Carrier for 3D curved surface fitting and defoaming
A curved surface and defoaming technology, applied in the field of 3D lamination, can solve the problems of FPC facing up without any protection, FPC prone to cracks, easy to form wrinkles, etc., to improve lamination yield, improve heating uniformity, The effect of increasing the viscosity of glue
Active Publication Date: 2019-12-03
BOE TECH GRP CO LTD +1
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- Application Information
AI Technical Summary
Problems solved by technology
[0004] In the existing technology, when degassing the 3D curved surface lamination products, the lamination workpiece is usually spread flat on the tray for the degassing process, which is very easy to form wrinkles and bubbles, which seriously affects the lamination rate
In addition, there is also a form of vertically inserting 3D curved surface lamination products into the tray for defoaming. However, the product will shake seriously in the tray, and there is no protection for the FPC to be placed upwards. prone to cracks
Method used
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[0029] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings.
[0030] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.
[0031] Such as Figure 1 to Figure 3 As shown, the carrier for 3D curved surface bonding and defoaming provided by the embodiment of the present invention includes a bottom plate 1 and at least two first U-shaped support assemblies 2, and the first U-shaped support assembly 2 includes at least one ...
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The invention discloses a carrier for 3D curved surface fitting and defoaming. The carrier comprises a bottom plate and at least two first U-shaped supporting assemblies, each first U-shaped supporting assembly comprises at least one first U-shaped groove, and the first U-shaped grooves correspondingly formed in the first U-shaped supporting assemblies are aligned in the first direction and are through in the first direction; the opening directions of the first U-shaped grooves in the first direction are the same, and the opening directions of the first U-shaped grooves and the bottom plate form an inclined angle. According to the carrier provided by the invention, a 3D curved surface laminating product is laminated and supported through the inclined first U-shaped grooves; and meanwhile,the 3D curved surface laminating product is obliquely placed relative to the bottom plate in the defoaming process, so that the heating uniformity of the product can be effectively improved, the adhesiveness of adhesives is improved, bubbles are reduced, and the laminating yield is increased.
Description
technical field [0001] The present invention generally relates to the technical field of 3D bonding, and in particular to a carrier for 3D curved surface bonding and defoaming. Background technique [0002] With the rapid development of technology, full-screen mobile phones occupy a large market share. Full-screen literally means that the front of the mobile phone is all screens, and the pursuit of a screen-to-body ratio close to 100%. The four sides of the full-screen mobile phone are treated with curved surfaces, and 3D rounded corner structures will appear on the four corners. In the process of producing a full-screen mobile phone, a glass cover is mounted on a flexible display panel, and then defoaming is performed. Mounting and defoaming are essential processes in the mobile phone assembly process. [0003] In the present invention, the bonding workpiece formed by bonding the glass panel to the flexible display panel is called a 3D curved surface bonding product. Base...
Claims
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Login to View More IPC IPC(8): G09F9/30
CPCG09F9/301
Inventor 黄修雄王鹏吴兆明曹春生姜成才
Owner BOE TECH GRP CO LTD