Preprocessing device for chip detection

Abstract

The embodiment of the invention discloses a preprocessing device for chip detection. The device comprises a supporting table, a first lead screw, a tool apron and a push broach; a base is arranged onthe supporting table, and a rectangular groove for containing a chip is formed in the base; a first sliding rail is arranged on the supporting table, and the first lead screw is rotatably arranged onthe supporting table; a push broach is arranged on the tool apron, and the tool apron is slidably arranged on the first sliding rail on the supporting table, and the tool apron is meshed with the first lead screw. According to the invention, the first lead screw rotates to drive the tool apron and the push broach to slide along the first sliding rail, and the push broach shovels solder balls placed on a chip substrate in the rectangular groove of the base when sliding. The device is simple in structure and convenient to use, the shoveled solder balls are uniform in height, and the accuracy ofsubsequent detection of distortion and bow values of the chip is guaranteed.

Description

Technical field [0001] The embodiment of the present invention relates to the field of chip technology, in particular to a pre-processing device for chip detection. Background technique [0002] With the advancement of integration technology, the improvement of equipment and the use of deep sub-micron technology, the integration of silicon single-chips has continued to increase, the number of I / O pins has increased sharply, and the power consumption has also increased. The packaging requirements for integrated circuits have become more strict. In order to meet the development needs of integrated circuits, on the basis of the original packaging varieties, a new packaging method-ball grid array packaging, referred to as BAG (Ball Grid Array Package), is added. [0003] BAG (Ball Grid Array Package) chip products are cube-shaped. After the chip is packaged, a thermal distortion test is required to detect the distortion and bow of the chip. The projection moire technology (Shadow Moi...

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Problems solved by technology

[0004] The inventors of the present application have found that due to the chip products of BAG (Ball Grid Array Package) in the prior art, there are protruding solder balls on the chip substrate on one side, which will be affected by the height of the solder balls, which will cause the chip to be tested. The twist and bow values ​​deviate, so it is necessary to remove the solder balls on the chip substrate before accurately testing the chip

In the existing production, the solder balls on the chip substrate are generally removed by manual scraping with a blade. There are problems of uneven height and low efficiency of scraping the solder balls, and there is a risk of the chip being scratched

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