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Double-layer wire-to-board IDC connector

A connector, double-layer technology, applied in the direction of connection, fixed connection, conductive connection, etc., can solve the problems of insufficient holding force, broken hook, poor elasticity, etc., and achieve the effect of improving the service life

Pending Publication Date: 2019-12-13
江苏益鑫通精密电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Disadvantages of the above connectors: 1. The connector hook is made of plastic material, which is less elastic than metal, and the pressing feel is not good when opening and closing
2. If high-strength plastic materials are used, there is a risk of the hook breaking
3. If the material with good toughness is used, the holding force will be insufficient after the mating of the male and female

Method used

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  • Double-layer wire-to-board IDC connector
  • Double-layer wire-to-board IDC connector
  • Double-layer wire-to-board IDC connector

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Such as Figure 1-5 A double-layer wire-to-board IDC connector is shown, including a plastic body 1, a wire terminal 2, a plastic back plug 3 and a shrapnel 4, and the plastic body 1 is provided with a main accommodation chamber and several first terminal accommodation chambers 5 The plurality of first terminal accommodation cavities 5 are integrally formed with the plastic body 1, the number of the plurality of first terminal accommodation cavities 5 is the same as the number of wire terminals 2, and the wire terminals 2 include first terminals 21 and second terminals 22. The first terminal 21 is inserted into the first terminal accommodating cavity 5, and a plurality of second terminal accommodating cavities 10 are opened in the plastic rear plug 3, and the plurality of second terminal accommodating cavities 10 are integrally formed with the plastic rear plug 3, several The number of the second terminal accommodating chamber 10 is the same as the number of wire termin...

Embodiment 2

[0034] The number of the first terminal accommodating cavity 5 , the lead terminals 2 and the second terminal accommodating cavity 10 in this embodiment is different from that in the first embodiment.

[0035] Way of working:

[0036] Such as Figure 7 As shown, insert the cable 14 into the slot 15 of the plastic rear plug 3, press the plastic body 1 downward, and then move the wire terminal 2 downward, so that the second terminal 22 punctures the cable 14, and then Continue to press so that several snap-in bumps 7 snap into the first snap-in portion 12 on the connection plate 11, and the metal conductive terminal is forced to be pierced by the sharp part 23 through the outer skin of the connector through the closure of the back plug, and contacts with the core wire of the cable 14 , so as to realize the conduction of the circuit; when the connector is disassembled, press the elastic arm 8 inward, so that the elastic arm 8 is opened, so that the plastic back plug 3 is removed...

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Abstract

The invention discloses a double-layer wire-to-board IDC connector which comprises a plastic body, a wire terminal, a plastic rear plug and an elastic piece. A main accommodating cavity and a number of first terminal accommodating cavities are arranged in the plastic body. The wire terminal comprises first terminals and second terminals. The first terminals are inserted into the first terminal accommodating cavities. A number of second terminal accommodating cavities are arranged in the plastic rear plug. The second terminals are inserted into the second terminal accommodating cavities. A number of clamp projections are arranged on two opposite sides of the plastic body respectively. First clamp members are arranged on two opposite sides of the plastic rear plug. Each first clamp member comprises a connecting plate and a first clamp part. An insert cavity is arranged at the lower part of the plastic rear plug. The elastic piece is arranged in the insert cavity. According to the SMC IDCline end connector provided by the invention, a material with good toughness is adopted to guarantee good hand feeling when pressed, and the service life of the connector is improved.

Description

technical field [0001] The invention relates to the technical field of connectors, in particular to a double-layer wire-to-board IDC connector. Background technique [0002] IDC wire-end connectors can be used for wire-to-board signal transmission in various industries, including automotive, industrial, communication, etc. SMCIDC line-end connector, double-layer PIN structure, pitch 1.27mm, which is used to realize reliable and compact plug connection. Cooperating with different types of board header connectors, such as vertical or angled board header connectors, different wire-to-board solutions can be realized. The cable is directly inserted into the slot of the connector back plug, and the IDC slot of the metal conductive terminal is forced to pierce the outer cover of the cable through the closure of the connector back plug, and contacts with the core wire of the cable, thereby realizing the conduction of the circuit. Disadvantages of the above-mentioned connectors: 1....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/506H01R4/2404H01R9/03H01R9/22H01R12/53H01R12/75
CPCH01R13/506H01R4/2404H01R9/031H01R9/22H01R12/53H01R12/75
Inventor 南阳边森袁双林严明莉
Owner 江苏益鑫通精密电子有限公司
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