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Modular rail systems, rail systems, mechanisms, and equipment for devices under test

一种测试器件、轨道的技术，应用在电气测量仪器的零部件、电子电路测试、金属加工设备等方向，达到测试性能简单调整的效果

Active Publication Date: 2019-12-20
CELEDON SYST GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Arms cover many parts of the wafer, limiting the number of sites that can be tested simultaneously

Method used

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  • Modular rail systems, rail systems, mechanisms, and equipment for devices under test
  • Modular rail systems, rail systems, mechanisms, and equipment for devices under test
  • Modular rail systems, rail systems, mechanisms, and equipment for devices under test

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Embodiment Construction

[0027] Embodiments disclosed herein relate generally to multi-site precision positioning mechanisms and, in particular, are directed to positioning a multi-probe array (e.g., across a wide Temperature range testing of semiconductor devices in semiconductor wafers).

[0028] Embodiments disclosed herein relate generally to systems, devices, and methods suitable for use in closed environments capable of controlling light, air, and / or electromagnetic interference. The test temperature of a DUT (eg, a wafer) can range from -65°C to 300°C and beyond. Some tests have measurements at multiple temperatures. The systems, devices and methods herein can be finely targeted to multiple sites and at desired temperatures and ranges. The systems, devices, and methods herein can provide a controlled environment to minimize thermal disturbances or effects that could misalign probe deflection (eg, when the system returns to thermal equilibrium).

[0029] The systems, devices, and methods here...

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Abstract

The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range oftemperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems,apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in adensely packed array.

Description

technical field [0001] The present disclosure relates generally to multi-site precision positioning mechanisms, and in particular, to positioning multi-probe arrays for devices under test (DUTs) (e.g., testing semiconductor devices in a semiconductor wafer across a wide temperature range) installation. Background technique [0002] Semiconductor circuit components are constantly getting smaller. Smaller processes will require larger test sample sizes and less stressful, longer-duration tests. [0003] With the advent of smaller devices there is also manufacturing pressure to reduce the size of the electrical contact pads. Smaller contact pads would require higher probe positioning accuracy in both XY and Z. Probe techniques designed for smaller pads may also have a smaller error margin in Z overtravel before they are damaged. The result may be small mechanical perturbations that would not be a problem with relatively large pads (e.g., 100µ0 or 200µ0 sized pads), but woul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/073G01R31/26G01R31/28
CPCG01R1/07307G01R31/2601G01R31/28G01R31/2875G01R31/2891G01R31/2874G01R31/2887B23Q1/00
Inventor 约翰·L·戴克李威廉·A·芬克布莱恩·J·鲁特
Owner CELEDON SYST GMBH
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