Modular rail system, rail system, mechanism and equipment for devices under test

Abstract

The systems, apparatus, and methods herein can provide a multi-site location mechanism suitable for testing device(s) under test ( DUT) (for example, semiconductor wafers) for long-term testing. The systems, devices, and methods herein include mounting components, mechanisms, and structures that provide excellent mechanical stability, allow for high-resolution optics at relatively close working distances, and enable Precise positioning is enabled at elevated temperatures in a controlled environment with minimal thermal disturbance. The systems, devices and methods herein can be modular, eg, modular to have rails and test sites that can be easily added or removed and that can allow access to probe modules in densely packed arrays.

Description

technical field [0001] The present disclosure relates generally to multi-site precision positioning mechanisms, and in particular, to positioning multi-probe arrays for devices under test (DUTs) (e.g., testing semiconductor devices in a semiconductor wafer across a wide temperature range) installation. Background technique [0002] Semiconductor circuit components are constantly getting smaller. Smaller processes will require larger test sample sizes and less stressful, longer-duration tests. [0003] With the advent of smaller devices there is also manufacturing pressure to reduce the size of the electrical contact pads. Smaller contact pads would require higher probe positioning accuracy in both XY and Z. Probe techniques designed for smaller pads may also have a smaller error margin in Z overtravel before they are damaged. The result may be small mechanical perturbations that would not be a problem with relatively large pads (e.g., 100µ0 or 200µ0 sized pads), but woul...

AI Technical Summary

Problems solved by technology

Arms cover many parts of the wafer, limiting the number of sites that can be tested simultaneously

Images