A system and method for detecting heating and vaporization of a liquid-cooled leaking conduit

Abstract

The present invention proposes a system and method for detecting heating and vaporization of a liquid-cooled water leakage conduit. Module; the detection module is connected to the metal layer through a microstrip line, which is used to detect the change of the electromagnetic induction impedance formed between the metal layer and the electromagnetic induction coil due to the influence of the liquid leakage on the metal layer, and the electromagnetic induction coil is also connected to the power supply module , when liquid leakage occurs, the power supply module supplies power to the electromagnetic induction coil to generate a high-frequency electromagnetic induction magnetic field, and the metal layer is subjected to the action of the high-frequency electromagnetic induction magnetic field to heat itself, so that the resulting leakage liquid is vaporized. Based on the system proposed by the invention, a method for detecting the heating and vaporization of the liquid-cooled leaking water conduit is also proposed. The present invention overcomes the liquid-cooled water leakage problem in the liquid-cooled server system, and provides a very efficient heat dissipation protection scheme for the liquid-cooled server.

Description

technical field [0001] The invention belongs to the technical field of server heat dissipation, and in particular relates to a system and method for detecting heating and vaporization of a liquid-cooled leaking conduit. Background technique [0002] In today's server systems, the problem of heat dissipation is becoming more and more important. Therefore, a module that guides important chips in the server into liquid-cooled water pipes for heat dissipation has been developed. With the continuous advancement of semiconductor technology, the heating power of microprocessors is also constantly rising. Generally, traditional heat dissipation methods are bound to fail to meet this trend. [0003] Such as figure 1 A schematic diagram of the heat flow of the conduit of the liquid-cooled heat dissipation module in the prior art is given. The heat energy of the heating module is taken away through the liquid-cooled duct. During the process, the hot air in the duct of the liquid-cool...

AI Technical Summary

Problems solved by technology

The heat energy of the heating module is taken away through the liquid-cooled pipe. During the process, the hot air in the pipe of the liquid-cooled heat dissipation module is cooled, so after the temperature drops, water droplets will form and adhere to the pipe, which will easily cause the risk of system short circuit

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