Heat dissipation device for reinforced VPX sealed case

Abstract

The invention discloses a heat dissipation device for a reinforced VPX sealed case. The heat dissipation device comprises a VPX plugboard, a guide rail heat dissipation structure and a sealed case, the VPX plugboard comprises a PCB, a cold board substrate is arranged on the PCB, and a heat pipe substrate and a heat pipe radiator are arranged on the cold board substrate. A plurality of grooves is formed in one side of the heat pipe substrate, and one or more first heat pipes are embedded in the grooves. The heat pipe radiator is fixedly connected with one end of the first heat pipe; the guide rail heat dissipation structure comprises two spliced heat dissipation fins, each heat dissipation fin comprises a guide rail base body and heat dissipation teeth which are integrally formed, a long groove allowing the guide rail base body to extend into the sealed case is formed in the sealed case, the guide rail base body is partially located in the sealed case, and the heat dissipation teeth arepartially located outside the sealed case; by means of two-stage heat pipe conduction and air cooling heat dissipation, heat in the sealed case is conducted to the outside of the sealed case, the structural design requirement for the sealed case is lowered, the structure is simplified, machining and design are convenient, and the heat dissipation efficiency is improved.

Description

technical field [0001] The invention relates to the field of reinforced computer technology and reinforced information processing technology, in particular to a heat dissipation device for reinforced VPX sealed chassis. Background technique [0002] As the performance of components such as the CPU and various functional chips in the VPX board has been greatly improved, its heat generation has also increased significantly. In the field of industrial control and national defense, the VPX bus chassis is reinforced to meet the special environment and electromagnetic compatibility requirements. Due to the closed working environment of the reinforced VPX sealed chassis, the heat can only be dissipated by heat conduction. The VPX board is usually inserted into the backplane connector along the guide rail. The contact area between the metal heat dissipation cold plate of the board and the guide rail is small, and the contact thermal resistance is large, and the thermal resistance of...

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Problems solved by technology

[0003] The purpose of the present invention is to provide a heat dissipation device for strengthening the VPX sealed chassis, so as to overcome the problems that the reinforced VPX sealed chassis has a large amount of heat and its own conduction thermal resistance is too large

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