Electronic component online high and low temperature detection device, high and low temperature test socket and chip high and low temperature test method

Abstract

The invention discloses an electronic component on-line high and low temperature detection device, a high and low temperature test socket and a chip high and low temperature test method. The electronic component on-line high and low temperature detection device comprises the test socket, a base body of the test socket is provided with an installation hole or groove, and the base body is made of a first heat conduction material; the base body is provided with a heating device located on the outer side of the installation hole or groove and a medium pipeline surrounding the installation hole or groove, the medium pipeline is made of a second heat conduction material, the heat conduction coefficient of the second heat conduction material and the heat conduction coefficient of the first heat conduction material are both not lower than 300 W / m.K, and the inlet end of the medium pipeline is connected with a cooling medium supply pipeline. According to the scheme, a heating structure and a cooling structure are integrated on the base body, rapid conversion of temperature is effectively guaranteed by combining the design of the heat conductivity of materials and accelerating heat conduction, the temperature can be completely loaded into an online detection system, functional integrity testing of electronic elements in high and low temperature environments is achieved, and reliability and accuracy of a testing structure are guaranteed.

Description

technical field [0001] The invention relates to the field of electronic component testing devices, in particular to an electronic component online high and low temperature testing device, a high and low temperature testing socket and a chip high and low temperature testing method. Background technique [0002] The complexity of chips is getting higher and higher. In order to ensure that there are no problems with the chips shipped, it is necessary to test them before leaving the factory to ensure functional integrity. As chips are mass-produced, large-scale automated testing is the only solution. Generally speaking, it includes pin functional integrity test, leakage current test, some DC (direct current) tests, functional test (functional test), Trim test, there will be some other tests according to the chip type, such as AD / DA will have Specialized some test types. [0003] The purpose of chip testing is to save costs as much as possible while finding good chips. Therefore...

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Problems solved by technology

[0006] At this stage, the use of "atmosphere" technology can achieve heating, but the cooling of products, as well as high and low temperature impact tests, due to the limitations of various technologies, currently the industry mainly uses "cold blowing" technology, It is to blow the set "cold air" around the product to make the product reach the set cooling temperature. In this case, the test is carried out, and its characteristics are: the set temperature of the cold air is difficult to reach, and the temperature control range is difficult to control , the heat dissipation efficiency is very poor, and the demand time is long. It is mainly used for laboratory testing and cannot be used for online testing of products.

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