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Temperature measurement device and temperature measurement method

一种温度测定、半导体的技术，应用在测量装置、温度计、采用电装置等方向，能够解决难小型化、不能够修正第一晶体管第二晶体管失配等问题，达到精度提高的效果

Active Publication Date: 2019-12-24
SOCIONEXT INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the above-mentioned conventional technology, it is impossible to correct the difference between the first transistor included in the current source unit and the first transistor included in the sensor unit, and between the second transistor included in the current source unit and the second transistor included in the sensor unit. mismatch between
[0007] Therefore, in the conventional technology, in order to maintain the accuracy of temperature measurement, in each of the current source unit and the sensor unit, it is necessary to set the element sizes of the first and second transistors to such a degree that the influence of the mismatch can be suppressed, and it is difficult to further miniaturization

Method used

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  • Temperature measurement device and temperature measurement method
  • Temperature measurement device and temperature measurement method
  • Temperature measurement device and temperature measurement method

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no. 1 approach

[0022] Hereinafter, a first embodiment will be described with reference to the drawings. figure 1 It is a figure explaining the temperature measuring device of 1st Embodiment.

[0023] The temperature measuring device 100 of the present embodiment includes a sensor unit 110 , an ADC (Analog to Digital Converter: analog-to-digital converter) unit 120 , a digital operation unit 130 , and a control unit 140 .

[0024] The sensor unit 110 includes a current source that supplies a current used as a reference for temperature measurement, and converts the temperature into a voltage value. In this embodiment, the temperature measuring device 100 can be downsized by including a current source in the sensor unit 110 . Details of the sensor unit 110 will be described later.

[0025] The ADC unit 120 converts the voltage output from the sensor unit 110 into a digital value by A / D (Analog to Digital) conversion. The digital operation unit 130 calculates the temperature measurement value...

no. 2 approach

[0117] Hereinafter, a second embodiment will be described with reference to the drawings. The second embodiment differs from the first embodiment in that the sensor unit does not have the selector 113 . Therefore, in the following description of the second embodiment, only the differences from the first embodiment will be described, and the parts having the same functional configuration as those of the first embodiment will be added with those described in the description of the first embodiment. The same reference numerals are used, and descriptions thereof are omitted.

[0118] Figure 9 It is a figure explaining the structure of the temperature measurement apparatus of 2nd Embodiment. 100A of temperature measurement apparatuses of this embodiment have sensor part 110A, ADC part 120, digital operation part 130, and control part 140A.

[0119] In addition, although in Figure 9 In an example, the temperature measurement device 100A is configured to include the ADC unit 12...

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Abstract

Provided is a temperature measurement device that has: first and second semiconductor elements each having a p-n junction; a transistor group that comprises a plurality of transistors in which the sources are connected to a power supply and the respective gates are connected to each other to form a current source, and that outputs a first current and a second current of a magnitude different fromthat of the first current to the first and second semiconductor elements; and a selector which selects, from among the plurality of transistors, at least one first transistor and a plurality of secondtransistors different from the first transistor and which connects the drain of the first transistor to one of the first and second semiconductor elements and the drain of the second transistor to the other of the first and second semiconductor elements.

Description

technical field [0001] The present invention relates to a temperature measuring device and a temperature measuring method. Background technique [0002] Conventionally, temperature measurement devices have been proposed that improve the accuracy of temperature measurement while suppressing an increase in area. [0003] As an example, conventionally, there is a current source unit that generates a current used as a reference for temperature measurement, a sensor unit that generates a voltage proportional to an absolute temperature based on the current value, and an ADC unit that A / D converts the voltage. Measuring device. In this temperature measuring device, it is known to detect and correct the mismatch of transistors and resistors constituting each current source unit, sensor unit, and ADC unit by dynamically switching with switches and measuring temperature. [0004] In addition, in this temperature measurement device, it is known that the current source unit and the se...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/01
CPCG01K7/01G01K2219/00G01K3/005
Inventor 滨野宽之宫崎敬史
Owner SOCIONEXT INC