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Control and optimize indirect evaporative cooling units for data center cooling

A data center, evaporative cooling technology, used in inter-data center, refrigeration and liquefaction, airflow control components, etc., to solve problems such as traditional solutions are not reliable and effective solutions

Active Publication Date: 2021-10-08
BAIDU USA LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional solutions may not be a reliable and effective solution for the situation described in this document

Method used

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  • Control and optimize indirect evaporative cooling units for data center cooling
  • Control and optimize indirect evaporative cooling units for data center cooling
  • Control and optimize indirect evaporative cooling units for data center cooling

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Embodiment Construction

[0031] Various embodiments and aspects of the invention will be described with reference to details discussed below and illustrated in the accompanying drawings. The following description and drawings are illustrative of the present invention and should not be construed as limiting the present invention. Numerous specific details are described in order to provide a thorough understanding of various embodiments of the invention. However, in certain instances, well-known or conventional details are not described in order to provide a concise discussion of embodiments of the invention.

[0032] Reference in this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present invention. The appearances of the phrase "in one embodiment" in various places in this specification are not necessarily all referring to the same embodimen...

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Abstract

Embodiments of the present invention provide a control solution for data center thermal management and control using an IDEC system. The data center is arranged in a cold air room wall supply and hot air room wall return configuration. Sensors such as temperature sensors and / or pressure sensors are used to measure and record thermal data. The data is then processed and used to control the IDEC system to adjust operating conditions to meet the dynamic thermal requirements of the data center. Control functions include: 1) controlling the IDEC system to adjust cooling modes and operating conditions as needed to maintain an appropriate data center thermal environment; and 2) identifying different optimal operating conditions and parameters for the IT room and IDEC system.

Description

technical field [0001] Embodiments of the invention generally relate to data centers. More specifically, embodiments of the invention relate to controlling and optimizing indirect evaporative cooling units for data centers. Background technique [0002] Heat removal is a prominent factor in computer system and data center design. As server performance improves, the number of servers deployed in a data center increases steadily, increasing the heat generated by the servers during normal operation. If the environment in which the server is allowed to operate increases in temperature over time, the reliability of the server used in the data center will decrease. A significant portion of a data center's power is used to dissipate the heat generated by the electronic equipment housed in the servers. As the number of servers in the data center increases, the data center consumes more power to cool electronic components in the servers. [0003] Indirect evaporative cooling / cool...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H05K7/14
CPCH05K7/1488H05K7/20718H05K7/208H05K7/20836F24F3/048F24F5/0035F25B25/005F25B49/02F24F11/64F24F11/80F24F2110/10F24F2110/40H05K7/20745H05K7/20827Y02B30/54F24F13/14F25B39/02F25B2339/021
Inventor 高天翼
Owner BAIDU USA LLC