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An intelligent device and method for producing semiconductor material foil

A technology of semiconductors and receiving troughs, applied in general control systems, program control in sequence/logic controllers, instruments, etc., can solve the problems of silicon foils that cannot be flattened and the accuracy of silicon foils is not high enough, and achieve easy transportation and precision high degree of effect

Active Publication Date: 2021-03-02
DATONG XINCHENG NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When cutting silicon foil in the prior art, most of them cannot keep the silicon foil flat, resulting in insufficient accuracy of the cut silicon foil

Method used

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  • An intelligent device and method for producing semiconductor material foil
  • An intelligent device and method for producing semiconductor material foil
  • An intelligent device and method for producing semiconductor material foil

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Embodiment Construction

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] The present invention provides such Figure 1-6 The shown intelligent device for producing semiconductor material foil includes a manufacturing table 1, a processing tank 2 is opened on the top wall of the manufacturing table 1, a cutting blade 3 is arranged in the processing tank 2, and the inner side wall of the processing tank 2 is There is a mounting slot for accommodating the transmission shaft 4 and the motor 5. There is a receiving tank 6 communi...

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Abstract

The invention discloses an intelligent device for producing semiconductor material foil, which includes a manufacturing table, a processing slot is opened on the top wall of the manufacturing table, a cutting blade is arranged in the processing slot, and a transmission drive is provided on the inner side wall of the processing slot. shaft and motor installation groove, there is a receiving trough connected with the processing tank in the manufacturing platform, a stretching rod and a pusher plate are arranged in the inner cavity of the receiving trough, and there is a Four groups of side grooves are distributed on both sides thereof, and four groups of moving blocks are arranged in total and are respectively located in the four groups of side grooves, and lifting rods are arranged in the four groups of side grooves. In the intelligent device and method for producing semiconductor material foil, four sets of rotating shafts and four sets of extruding cylinders are arranged, and the four sets of extruding cylinders are distributed on both sides of the cutting blade, so that the two sides of the silicon foil to be cut are respectively in four directions. Under the action of a group of extrusion cylinders, it is kept horizontal, so that the cut silicon foil is relatively flat, and the cutting accuracy is higher.

Description

technical field [0001] The invention belongs to the technical field of semiconductor foil production, and in particular relates to an intelligent device and method for producing semiconductor material foil. Background technique [0002] An important step in the production of semiconductor foils is the cutting of the produced silicon foils. The application fields of silicon foil are very wide, from daily life to industrial service industry, you can see the shadow of silicon foil. Therefore, the quality of silicon foil produced in the factory directly determines the quality of semiconductor foil. [0003] When using equipment to cut silicon foil, it is usually necessary to use a motor to drive the cutting knife to rotate to cut it. When cutting the silicon foil in the prior art, most of the silicon foil cannot be kept flat, resulting in insufficient accuracy of the cut silicon foil. Contents of the invention [0004] The object of the present invention is to provide an in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/05
CPCG05B19/058G05B2219/163
Inventor 郭志宏张培林武建军柴利春王志辉张作文纪永良
Owner DATONG XINCHENG NEW MATERIAL CO LTD