Package body and light emitting device using same
A technology for encapsulating the main body and device, applied in the direction of electric solid device, semiconductor device, semiconductor/solid state device components, etc., can solve the problems of material reflectivity and optical properties reduction, material failure, etc. Effect
Pending Publication Date: 2020-01-17
SHENZHEN SKYWORTH RGB ELECTRONICS CO LTD +1
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Problems solved by technology
High power densities per unit area can lead to material failures, including delamination of integrated components of LED packages and degradation of reflectivity and optical properties of materials
Method used
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[0058] The present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the disclosure are shown. However, this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. The same reference numerals denote the same elements throughout.
[0059] The terms used in this specification generally have their ordinary meanings in the art, both within the context of this disclosure and in the specific context where each term is used. Certain terms used to describe the present disclosure are discussed below or elsewhere in the specification to provide practitioners with additional guidance regarding the description of the present disclosure. For convenience, certain t...
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Abstract
A package body for a semiconductor device includes a lead frame, an insulating package, and a reflective coating layer. The lead frame has a first electrode and a second electrode separated from eachother. The insulating package provides a housing structure and forming a package cavity therein. The package cavity has a reflective side surface formed by the insulating package. The reflective coating layer partially covers the first electrode and the second electrode and forms a reflective bottom surface of the package cavity. Each of the first electrode and the second electrode may have an angled cut. The insulating package may be made of a binder-filler composite containing white pigments. The package body may be an all diffusive integrated reflecting surfaces (AR-IRS) package body, and may be used in an encapsulant-free semiconductor package.
Description
technical field [0001] The present disclosure generally relates to the field of liquid crystal displays, and more particularly, to a package body with an all-diffuse integrated reflective surface (AD-IRS) for a light emitting device, and a light emitting device using the AD-IRS package body. Background technique [0002] The background description provided in this disclosure is intended to generally present the context of the disclosure. Subject matter discussed in the Background of the Disclosure section should not be admitted to be prior art solely by virtue of being mentioned in the Background of the Disclosure section. Similarly, issues mentioned in the Background of the Disclosure or related to the subject matter of the Background of the Disclosure should not be considered to have been previously recognized in the prior art. The subject matter in the Background of the Disclosure section merely represents different approaches, which may themselves be disclosures. The w...
Claims
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IPC IPC(8): H01L33/54
CPCH01L2224/48091H01L2924/181H01L33/486H01L33/62H01L33/60H01L2933/0033H01L2933/0058H01L2933/0091H01L33/46H01L2924/00014H01L2924/00012H01L33/465H01L33/382H01L23/49582
Inventor 尤君平阮德兰
Owner SHENZHEN SKYWORTH RGB ELECTRONICS CO LTD