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Post-adhesive bonding method of t-shaped embedded parts of satellite honeycomb sandwich panel

A technology of honeycomb sandwich panels and satellites, which is applied in the field of composite materials, can solve problems such as increased processing costs, large curing stress, and inability to guarantee design accuracy, and achieve the effect of reducing processing costs and reducing impact

Active Publication Date: 2022-03-29
SHANGHAI COMPOSITES SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The simple embedding method cannot guarantee the design accuracy due to the large curing stress, while the method of embedding combined with machining has higher requirements on tooling and molds, and greatly increases the processing cost

Method used

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  • Post-adhesive bonding method of t-shaped embedded parts of satellite honeycomb sandwich panel
  • Post-adhesive bonding method of t-shaped embedded parts of satellite honeycomb sandwich panel

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Embodiment Construction

[0030] The following is a detailed description of the embodiments of the present invention: this embodiment is implemented on the premise of the technical solution of the present invention, and provides detailed implementation methods and specific operation processes. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

[0031] The invention provides a height-adjustable post-glue positioning device for T-shaped embedded parts of satellite honeycomb panels, which can continuously and accurately level the satellite honeycomb sandwich panels by adjusting the height of multiple support points, reducing the number of product and post-glue positioning tools The assembly error between them can greatly improve the verticality between the honeycomb panel surface and the fitting surface of the T-shaped embedded pa...

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Abstract

The post-gluing method of the T-shaped embedded part of the satellite honeycomb sandwich panel of the present invention comprises the following steps: Step 1, assembling the T-shaped positioning block and the side positioning block; Step 2, gluing the T-shaped embedded part, and connecting and fixing it with the T-shaped positioning block; Step 3, adjust the height of each supporting block; Step 4, fix the satellite honeycomb sandwich board with the side positioning blocks. Compared with the prior art, the present invention has the following advantages: 1. The present invention can effectively, continuously and accurately adjust the vertical accuracy of the satellite honeycomb sandwich board and the positioning block. 2. The present invention adopts normal temperature post-glue T-shaped embedded parts, which can effectively reduce the influence of curing stress on the final dimensional accuracy of the product. 3. The present invention can greatly reduce the processing cost.

Description

technical field [0001] The invention belongs to the technical field of composite materials and relates to post-bonding of T-shaped embedded parts of satellite honeycomb sandwich panels. Specifically, it relates to a method for meeting the positioning accuracy and shape and position accuracy requirements of a T-shaped embedded part of a satellite honeycomb sandwich plate and greatly reducing processing costs. Background technique [0002] Honeycomb sandwich panels are important structural parts in spacecraft such as satellites. T-shaped embedded parts are common and important assembly components in honeycomb sandwich panels, which are mainly assembled by using adhesives for bonding. Generally, the honeycomb sandwich panel contains multiple T-shaped embedded parts, and the design requires that the flatness and verticality of the flanging combination are better than 0.1 mm and 0.15 mm, respectively, and the design accuracy is high. [0003] Prior art, Chinese invention patent...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C70/54B29C70/30B29L31/30
CPCB29C70/54B29C70/30B29L2031/3097
Inventor 杨亚辉郑印许波凯李宗周顾超熊涛孙海军孔垂千秦洪远
Owner SHANGHAI COMPOSITES SCI & TECH CO LTD
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