Electroplating device and electroplating method for forming electroplating structure on substrate

Abstract

The invention provides an electroplating device for forming an electroplating structure on a substrate. The device comprises a container, a substrate holder, a metal plate, a power supply and an auxiliary electrode, wherein the container is used for containing an electroplating solution, the substrate holder is used for holding the substrate to be electroplated within the container, the substrateholder is provided with a contact electrode in electrical contact with an electroplating seed layer on the surface of the substrate, the metal plate is disposed in the container in parallel with the substrate, the power supply is used for providing a current for electroplating the substrate and the metal plate; and the auxiliary electrode is positioned within the container and is disposed at a periphery of the electroplating region of the substrate, and the electroplating pattern of the auxiliary electrode is in equipotential communication with a surface of the electroplating region of the substrate. According to the device, uniform and stable electroplating can be achieved on the substrate simply and efficiently.

Description

Technical field [0001] The present application relates to the field of micro-machined technology, and more particularly to a plating device and a plating method of forming a plating structure on a substrate. Background technique [0002] During the manufacturing process of semiconductor devices, in particular micro-electromechanical systems (MEMS: Micro Electro Mechanical Systems), a variety of fine structures are often required to form a variety of fine structures. Especially some thickness of fine structures, and when the deep hole is needed, the electroplating method is better, the speed is faster, the cost is lower. For example, silicon vent (TSV: Through Silicon VIA), microcoil, etc., often requires a fine structure of metal using plating methods. [0003] In the production of semiconductor devices including MEMS, the electroplating process is usually performed in substrates. That is, there is often a need to electroplary a plurality of fine structures on each substrate. Whe...

AI Technical Summary

Problems solved by technology

However, on the one hand, the distribution of electroplating patterns on the substrate is usually uneven, which may lead to uneven electric field distribution

In order to adjust the electric field distribution between the substrate and the anode, a common method is to add a porous adjustment plate between the substrate and the anode, but this tends to increase the volume of the electroplating tank and hinder the flow of the electroplating solution

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