Method for manufacturing and using horizontal electrode configuration structure of nano-scale phase change memory cell

A phase change memory and configuration structure technology, applied in the field of microelectronics, can solve the problems of small reading current, unable to read correctly, large amorphous phase resistance, too small reading current, etc., so as to facilitate correct reading and reading. Take the effect of increasing the current and decreasing the threshold current

Active Publication Date: 2020-02-11
HUAZHONG UNIV OF SCI & TECH
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Problems solved by technology

Especially below the 10nm scale, the resistance of the amorphous phase becomes very large, resulting in too small a read current to read correctly, and a larger current is required to read
[0005] Therefore, it is necessary to propose a method for manufacturing a new electrode configuration structure suitable for nanoscale phase change units to solve the problem of too small read current and power consumption in the process of high-resistance amorphization at the nanoscale

Method used

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  • Method for manufacturing and using horizontal electrode configuration structure of nano-scale phase change memory cell
  • Method for manufacturing and using horizontal electrode configuration structure of nano-scale phase change memory cell
  • Method for manufacturing and using horizontal electrode configuration structure of nano-scale phase change memory cell

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Embodiment Construction

[0031] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other. The present invention will be further described in detail below in combination with specific embodiments.

[0032] As a preferred embodiment of the present invention, such as figure 1 As shown, the present invention provides a horizontal electrode configuration structure for nanoscale phase change memory cells, wherein:

[0033] The horizontal electrode configuration structure 100 includes an up...

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Abstract

The invention discloses a method for manufacturing and using a horizontal electrode configuration structure for a nano-scale phase change memory cell. A lower phase change material layer and an upperelectrode material layer are sequentially grown in accordance with the procedure. During processing, the upper electrode material layer forms an outer ring common drain ground electrode and an internal source terminal electrode based on the photolithography process of the same. When in use, the internal source terminal electrode is connected with a source terminal; the outer ring common drain ground electrode is grounded; and source and drain terminal exchange cannot be carried out. Current flows horizontally from the equipotential surface of the internal source terminal electrode to the outerring equipotential surface of the outer ring common drain ground electrode. For the high-resistance amorphous state, compared with a square structure, the structure has significantly reduced equivalent resistance value R and increased read current, and facilitates correct reading. In addition, the horizontal flow direction of the current reduces the series current loss of a two-terminal element in the general sense, thereby reducing the threshold current required for the amorphization process and reducing the overall power consumption.

Description

technical field [0001] The invention belongs to the field of microelectronics, and relates to a method for manufacturing and using a horizontal electrode configuration structure for a nanoscale phase change memory unit, in particular to the design and manufacture of a phase change memory element based on a chalcogenide phase change material method and its application. Background technique [0002] The phase change memory based on the chalcogenide phase change material can store information and data through the huge resistance difference between the crystalline phase and the amorphous phase, and can even achieve multi-level phase change storage. This phase-change process has the advantages of low power consumption and high-density cost as the size decreases, so the industry pays great attention to the development of nanoscale phase-change memory. [0003] At present, there are relatively mature applications in the structural design of phase change units, such as T-shaped str...

Claims

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Application Information

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IPC IPC(8): H01L45/00
CPCH10N70/231H10N70/841H10N70/011
Inventor 马平童浩缪向水
Owner HUAZHONG UNIV OF SCI & TECH
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