A cooling device for power distribution cabinets using the principle of semiconductor refrigeration chips
A technology of a heat sink and a cooling sheet, applied in the electric power field, can solve the problems of increasing the internal temperature of the cabinet, poor heat dissipation effect, and shortening the service life of electrical components, so as to increase the air flow speed, increase the effect of heat dissipation, and ensure normal operation. Effect
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[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0029] see Figure 1-8 , a heat dissipation device for a power distribution cabinet using the principle of a semiconductor refrigeration sheet, including a cabinet body 1, a shutter 2, a dust collector 3, a first air inlet 4, a baffle 5, a rotating plate 6, a connecting rod 7, and a gear 8 , the second air inlet 9, the third air inlet 10, the air inlet 11, the partition plate 12, the dust seal 13, the fan blade 14, the semiconductor cooling plate 15, the plung...
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