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Preparation method of tft array substrate and tft array substrate

An array substrate and substrate technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of copper electrode corrosion, corrosion, copper electrode oxidation, etc., and achieve the effect of avoiding corrosion and improving electrical conductivity.

Active Publication Date: 2022-06-07
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The invention provides a preparation method of a TFT array substrate and a TFT array substrate, which can avoid corrosion of copper electrodes in the stripping process, so as to solve the problem of the existing preparation method of TFT array substrates and TFT array substrates. In the manufacturing process of the electrode, the technical problem of copper electrode oxidation caused by the dry stripping process alone or the copper electrode corrosion caused by the wet stripping process alone

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  • Preparation method of tft array substrate and tft array substrate
  • Preparation method of tft array substrate and tft array substrate
  • Preparation method of tft array substrate and tft array substrate

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Embodiment Construction

[0030] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [up], [down], [front], [rear], [left], [right], [inner], [outer], [side], etc., are only for reference Additional schema orientation. Therefore, the directional terms used are for describing and understanding the present invention, not for limiting the present invention. In the figures, structurally similar elements are denoted by the same reference numerals.

[0031] The present invention aims at the preparation method of the existing TFT array substrate and the TFT array substrate. In the process of using copper electrodes to prepare the source and drain electrodes, the dry stripping process alone leads to oxidation of the copper electrodes, or the wet stripping process alone causes the copper electrodes to corrode This embodiment can solv...

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Abstract

The invention provides a preparation method of a TFT array substrate and the TFT array substrate, which mainly include: after the copper electrode is etched to form a source-drain metal film layer, the subsequent stripping process is carried out in two steps: the first step is to The photoresist on the source-drain metal film layer is dry stripped to remove part of the photoresist; the second step is to wet the remaining photoresist on the source-drain metal film layer. stripping, so as to strip the remaining photoresist to form source and drain electrodes. The method avoids corrosion of copper electrodes, and further improves the conductivity of the TFT array substrate.

Description

technical field [0001] The invention relates to the technical field of display driving, in particular to a preparation method of a TFT array substrate and a TFT array substrate. Background technique [0002] In the manufacturing process of TFT-LCD (thin film transistor-liquid crystal display panel) made of Cu process, when metal copper is used as the source and drain electrodes, the stripping technique usually adopts dry stripping or wet stripping. However, when pure dry stripping is used, not only is the photoresist easy to remain, but also because the plasma gas of dry stripping contains O, S and other elements, it is easy to cause oxidation or vulcanization of copper electrodes, and it is difficult to control the stripping end point, which in turn affects the opening of TFT transistors. The on-state current causes its on-state current to be too small. When wet peeling is used, the metal copper is easily corroded due to the strong alkalinity of the peeling solution and th...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/77H01L27/12
CPCH01L27/1248H01L27/1288H01L27/124
Inventor 柴国庆
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD