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Housing Assembly and Mounting Clips

A technology of housing components and mounting clips, which is applied in the direction of electrical components, coupling devices, parts of connecting devices, etc., can solve the problems of reducing the electrical performance of electronic equipment and achieve the effect of ensuring heat dissipation

Active Publication Date: 2021-06-25
TYCO ELECTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the operation of the transceiver module, the heat generated will reduce the electrical performance of the electronic equipment

Method used

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  • Housing Assembly and Mounting Clips
  • Housing Assembly and Mounting Clips
  • Housing Assembly and Mounting Clips

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Experimental program
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Embodiment Construction

[0038] While the present disclosure will be fully described with reference to the accompanying drawings containing preferred embodiments of the present disclosure, it should be understood before proceeding that those skilled in the art may modify the inventions described herein while obtaining the technical effects of the present disclosure. Therefore, it should be understood that the above description is a broad disclosure for those of ordinary skill in the art, and its content is not intended to limit the exemplary embodiments described in the present disclosure.

[0039] In addition, in the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a comprehensive understanding of the embodiments of the present disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in diagrammatic form to...

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PUM

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Abstract

Disclosed are a shell assembly and a mounting clip with a heat dissipation function. The mounting clip includes: at least one main body; at least one pair of holding arms, each pair of holding arms is connected to both sides of the main body, and includes a first connecting arm extending upwards substantially perpendicular to the main body; a holding arm extending with one end of a connecting arm away from the main body and substantially perpendicular to the first connecting arm; and a plurality of locking portions, at least two locking portions extending from the main body. The heat sink is reliably held on the casing of the electronic device, thereby ensuring the heat dissipation effect of the heat sink.

Description

technical field [0001] At least one of the present disclosure relates to an electronic device, in particular to an electronic device comprising a housing assembly with a heat dissipation function and a mounting clip. Background technique [0002] Various types of fiber optic or copper wire based transceivers are known that can communicate between electronic host equipment and peripheral devices. These transceivers may be housed in modules that are pluggably connected to a host device to provide flexibility in system configuration. The module is plugged into a socket mounted on a circuit board of the host device. The receptacle includes an elongated pedestal or cage having a front portion open to the interior space and an electrical connector disposed at the rear of the cage within the interior space. [0003] As technology continues to evolve, transceiver modules are required to transmit data signals at higher rates. During the operation of the transceiver module, the hea...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01R13/502H01R12/71
CPCH01R12/716H01R13/502H05K7/2039
Inventor 田扬进韩洪强杨洪文王陈喜刘文宇
Owner TYCO ELECTRONICS (SHANGHAI) CO LTD