Micro heat pipe structure with heat insulation vacuum cavity
A vacuum cavity and micro-heating technology, which is applied in the construction of electrical equipment components, cooling/ventilation/heating transformation, electrical components, etc., can solve the problems of increasing the thickness of electronic products, increasing the space occupied by micro-heat pipes and heat shields, etc. Achieve the best level of thermal conductivity, weight reduction, height reduction effect
Active Publication Date: 2020-03-17
GUANGZHOU NEOGENE THERMAL MANAGEMENT TECH CO LTD
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Problems solved by technology
However, because the conventional technology is to use the flattened micro-heat pipe device on the casing, and then try to add an additional heat shield, this increases the space occupied by the micro-heat pipe and the heat shield, thereby increasing the thickness of the electronic product.
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[0035] In order to make the advantages, spirit and characteristics of the present invention more easily and clearly understood, the following will be described and discussed in detail with reference to the accompanying drawings. It should be noted that these embodiments are only representative embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding embodiments.
[0036] In the description of the present invention, it should be understood that the orientations or positional relationships indicated by the terms "longitudinal, horizontal, up, down, front, back, left, right, top, bottom, inside, outside" are based on the drawings. The orientation or positional relationship shown is only for the convenience of describing the present invention and simplifies the description, but does not indicate that the device or element must have a specific orientat...
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A micro heat pipe structure with a heat insulation vacuum cavity comprises an upper cover, a heat insulation layer piece and a lower cover. The upper cover is provided with a strip-shaped groove structure, and the strip-shaped groove structure is provided with a groove inner face and forms an arrangement space. The heat insulation layer sheet is provided with a vacuum cavity, is accommodated in the arrangement space of the upper cover, and is attached to part of the inner surface of the groove. The lower cover is provided with a strip-shaped groove structure, and the strip-shaped groove structure is provided with a capillary structure. The lower cover is arranged in the arrangement space of the upper cover to form a cavity structure with a capillary structure on the inner side. The strip-shaped groove structure is partially attached to the heat insulation layer piece. A working fluid is accommodated in the cavity structure, and the interior of the cavity structure is in a negative pressure state, so that the upper cover and the lower cover form a micro heat pipe structure. In a limited space, the micro heat pipe structure is light and thin, and has the effects of isolating heat energy from being directly conducted from a heating point and quickly guiding the heat energy to a designated area for heat dissipation.
Description
technical field [0001] The invention provides a micro-heat pipe structure, especially a micro-heat pipe structure with a heat-insulated vacuum chamber so as to avoid the additional installation of a heat-insulating sheet. Background technique [0002] The development trend of electronic and handheld communication device products is constantly moving towards thinner profile and higher functionality, and people have higher and higher requirements for the computing speed and functions of the microprocessor (Microprocessor) in the device. Microprocessor is the core component of electronic and communication products. It tends to generate heat under high-speed operation and becomes the main heating element of electronic devices. If the heat cannot be dissipated immediately, local processing hot spot (Hot Spot) will be generated. If there is no good thermal management solution and heat dissipation system, it will often cause the microprocessor to overheat and fail to perform its du...
Claims
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IPC IPC(8): H05K7/20H05K5/02
CPCH05K5/0217H05K7/20336
Inventor 陈振贤
Owner GUANGZHOU NEOGENE THERMAL MANAGEMENT TECH CO LTD