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Manufacturing method of structural part, mold, shell and electronic equipment

A technology of structural parts and process, applied in the field of structural manufacturing, can solve problems such as overflowing glue

Active Publication Date: 2020-03-24
OPPO CHONGQING INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the sealing method of the edge of the injection molded stamping structural parts in the industry is easy to form obvious glue overflow

Method used

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  • Manufacturing method of structural part, mold, shell and electronic equipment
  • Manufacturing method of structural part, mold, shell and electronic equipment
  • Manufacturing method of structural part, mold, shell and electronic equipment

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Embodiment Construction

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0025] In related embodiments of the present application, in order to perform in-mold injection molding of structural parts, a mold is provided for performing in-membrane injection molding of structural parts.

[0026] Such as Figures 1 to 2 As shown, the mold 100 includes an upper mold 20 and a lower mold 10, the lower mold 10 has a cavity 11, the upper mold 20 and the lower mold 10 are opened, and hardware is placed in the cavity 11 31, then the upper mold 20 and the lower m...

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Abstract

The embodiment of the invention provides a manufacturing method of a structural part, a mold, a shell and electronic equipment. The method comprises a step of providing a first mold which comprises afirst mold body and a second mold body opposite to the first mold body, wherein the first mold body comprises a first surface close to the second mold body, the second mold can move towards or away from the first surface, and the first mold comprises a cavity, a step or providing a hardware piece and placing the hardware piece in the cavity, wherein one side of the hardware piece is subjected to injection molding to form the structural part, the structural part is provided with a first end face close to one side of an injection molding part and a second end face opposite to the first end face,a glue sealing face is formed between the first end face and a side wall of the cavity, the glue sealing face inclines to the movement direction of the second mold, and glue sealing treatment is conducted on the glue sealing face. Glue overflowing can be reduced during the injection molding of the structural part, and the quality of the structural part is improved.

Description

technical field [0001] The present application relates to the technical field of structural manufacturing, and in particular to a manufacturing method of a structural member, a mold, a housing and electronic equipment. Background technique [0002] In some products, in order to increase the strength of the structural parts, hardware parts are implanted in the cavity of the mold during injection molding, and the injection molding is completed as a whole, and the strength is greatly increased. When the structural parts injected in the mold are injected, the edges of the structural parts implanted in the mold cavity need to cooperate with the mold, leaving a gap for sealing to prevent the plastic from flowing to other areas. [0003] At present, the sealing method of the edge of the injection molded stamping structural parts in the industry is easy to form obvious glue overflow. Contents of the invention [0004] Embodiments of the present application provide a manufacturing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/14B29C45/26B29L31/34
CPCB29C45/0025B29C45/14B29C45/2602B29L2031/3406
Inventor 杨鑫
Owner OPPO CHONGQING INTELLIGENT TECH CO LTD
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