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Apparatus for testing the bond strength between multilayer bonded materials

A bonding material and bonding strength technology, applied in the direction of using mechanical devices, measuring devices, analyzing materials, etc., can solve the problem that the strength testing instruments and testing methods are not perfect, and it is impossible to accurately and conveniently test the bonding strength of multiple layers. junction strength performance and other issues, to achieve the effect of complete functions, simple structure and strong operability

Active Publication Date: 2021-10-19
HOHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] With the continuous advancement of material technology, the construction industry often encounters the situation of bonding between different bonding materials or layered bonding of the same bonding material, but the current laboratory aims at the bonding between bonding materials in the above cases. The strength test instruments and test methods are not perfect enough. At present, the test instruments for testing the bonding performance of bonding materials are mainly aimed at the bonding performance between liquid binders and solid materials. Taking asphalt materials as an example, the commonly used Asphalt and aggregate bond strength test instruments mainly include manual asphalt puller and automatic puller, etc.
[0004] Therefore, it is impossible to accurately and conveniently test the bond strength performance between multi-layer bond strengths through existing test instruments and means.

Method used

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  • Apparatus for testing the bond strength between multilayer bonded materials
  • Apparatus for testing the bond strength between multilayer bonded materials
  • Apparatus for testing the bond strength between multilayer bonded materials

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Embodiment Construction

[0020] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0021] like Figure 1~5 As shown, wherein: 101, the first pulling fixture; 102, the bonding test plate; 103, the control device; 104, the induction dynamometer; 105, the second pulling fixture; 106, the pulling regulator; 201 , base; 202, hydraulic mechanism; 203, hydraulic fixing system; 3, power supply device; 301, USB interface; 302, current processing module; 4, information processing module; 401, test data input module; 402, information processing and analysis module ; 403 , the information display screen; 501 , the first drawing head; 502 , the second drawing head; 503 , the bonding material.

[0022] The test device for bonding strength between multilayer adhesive materials of the present invention includes a base 201, a hydraulic mechanism 202 is arranged on both sides and in the middle of the base 201, and a hydraulic fixing...

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PUM

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Abstract

The invention discloses a test device for bonding strength between multilayer bonding materials, which comprises a base, a hydraulic fixing system arranged above the base, a hydraulic mechanism arranged between the base and the hydraulic fixing system; and is arranged on the base The first puller holder for fixing the auxiliary drawing device at the bottom of the sample is set above the first puller holder The second puller holder for fixing the top puller of the sample is set on the hydraulic fixing system A pull-out adjuster, the pull-out adjuster is connected to the second pull-out fixture, and a pull-inductive dynamometer is connected between the second pull-out fixture and the pull-out adjuster, and the The hydraulic mechanism is connected with the pulling regulator for applying force to the sample; the information processing module is connected with the induction force measuring device for obtaining test data. The invention is a bonding strength testing device capable of accurately and conveniently measuring the bonding strength between multilayer bonding materials, and is compatible with traditional bonding strength testing functions.

Description

technical field [0001] The invention relates to a strength testing device, in particular to a testing device for bonding strength between multilayer bonding materials. Background technique [0002] Bond strength is an important index to evaluate the performance of bonded materials. In many current pull-out tests of bonded materials, it is necessary to test the pull-out strength of bonded materials. Among them, the bonding strength between liquid solidified bonding materials and ordinary solid materials has been tested by relatively complete test instruments, and the test results are also relatively accurate. [0003] With the continuous advancement of material technology, the construction industry often encounters the situation of bonding between different bonding materials or layered bonding of the same bonding material, but the current laboratory aims at the bonding between bonding materials in the above cases. The strength test instruments and test methods are not perfec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N19/04
CPCG01N19/04
Inventor 吴建涛伍洋陈俊
Owner HOHAI UNIV
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