Apparatus for testing the bond strength between multilayer bonded materials
A bonding material and bonding strength technology, applied in the direction of using mechanical devices, measuring devices, analyzing materials, etc., can solve the problem that the strength testing instruments and testing methods are not perfect, and it is impossible to accurately and conveniently test the bonding strength of multiple layers. junction strength performance and other issues, to achieve the effect of complete functions, simple structure and strong operability
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[0020] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0021] like Figure 1~5 As shown, wherein: 101, the first pulling fixture; 102, the bonding test plate; 103, the control device; 104, the induction dynamometer; 105, the second pulling fixture; 106, the pulling regulator; 201 , base; 202, hydraulic mechanism; 203, hydraulic fixing system; 3, power supply device; 301, USB interface; 302, current processing module; 4, information processing module; 401, test data input module; 402, information processing and analysis module ; 403 , the information display screen; 501 , the first drawing head; 502 , the second drawing head; 503 , the bonding material.
[0022] The test device for bonding strength between multilayer adhesive materials of the present invention includes a base 201, a hydraulic mechanism 202 is arranged on both sides and in the middle of the base 201, and a hydraulic fixing...
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