Unlock instant, AI-driven research and patent intelligence for your innovation.

Methods and apparatuses for effluent monitoring for brush conditioning

An effluent, brush technology, applied in the direction of abrasive surface conditioning devices, wheels with flexible working parts, parts of grinding machine tools, etc., can solve problems such as non-immediate use

Pending Publication Date: 2020-03-24
ILLINOIS TOOL WORKS INC
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional brushes obtained from the manufacturer in a condition not ready for use

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Methods and apparatuses for effluent monitoring for brush conditioning
  • Methods and apparatuses for effluent monitoring for brush conditioning
  • Methods and apparatuses for effluent monitoring for brush conditioning

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] Various applications and methods can benefit from physical cleaning of surfaces. For example, in semiconductor manufacturing, semiconductor wafers may be cleaned to remove potentially damaging contaminants during one or more stages of fabricating electronic circuits on the wafer. Cleaning may be provided, for example, by brushes in contact with the surface to be cleaned. Conventional brushes are obtained from the manufacturer in a state that is not ready for use. For example, brushes may have contaminants that prevent objects from being cleaned. Accordingly, it may be desirable to condition (condition, break in) the brush to remove contaminants to a level acceptable for the intended use of the brush. Additionally or alternatively, one or more substances may be applied to the brush to condition the brush for a particular cleaning application.

[0017] Reference will be made to the examples in this disclosure to condition the surface of a semiconductor wafer, although ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Provided is a disclosure for embodiments that perform effluent monitoring for brush conditioning, where the monitored data may be fed back for use in the conditioning.

Description

[0001] related application [0002] This international application claims priority to U.S. Patent Application Serial No. 15 / 600,021, filed May 19, 2017, entitled "Methods and Apparatuses for Effluent Monitoring for Brush Conditioning." The entire contents of US Patent Application Serial No. 15 / 600,021 are incorporated herein by reference. Background technique [0003] The present disclosure relates to exudate monitoring, and more particularly, to methods and apparatus for exudate monitoring of brush conditioning. [0004] In the semiconductor manufacturing industry and other industries, brushes are used to remove contaminants from surfaces, such as semiconductor wafers. Conventional brushes are obtained from the manufacturer in a state that is not ready for use. Instead, brushes are typically conditioned (or "run-in") prior to use in the intended product. Chemicals used during brush conditioning (called effluent) can be collected for recycling and / or disposal. [0005] By ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67253H01L21/67017H01L21/67028B24B29/005B24D13/145B24B53/14B24B57/02H01L21/67046H01L22/26H01L21/67703H01L21/0201
Inventor 布拉德利·威瑟斯科里·艾伦·休斯埃里克·斯科特·纳尔逊史蒂芬·肯尼斯·克里斯蒂布伦特·艾伦·贝斯特
Owner ILLINOIS TOOL WORKS INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com