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Vacuum drying device

A technology of vacuum drying device and vacuum chamber, which is applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of inability to remove solvent, drip of solvent, and affect the process, and achieve the effect of avoiding the inability of solvent to be eliminated.

Active Publication Date: 2022-02-22
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This application provides a vacuum drying device to solve the problem that in the existing vacuum drying technology, since the vacuum drying process needs to be carried out at a lower temperature, the amount of solvent taken away by a single vacuuming method is limited, and the solvent cannot be completely removed. , causing the solvent to condense on the upper end of the vacuum drying device, and the long-term accumulation of the solvent drips on the surface of the substrate, thereby polluting the device and affecting the process

Method used

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Embodiment 1

[0049] see Figure 4 , the vacuum drying device further includes a vacuum extraction mechanism 70 disposed on the vacuum chamber 10 .

[0050] The vacuum pumping mechanism 70 includes a pumping port 701 , and the pumping port 701 communicates with the vacuum chamber 10 .

[0051] The first cooling mechanism 40 includes at least two through holes 402 arranged at intervals, and the diameters of at least two through holes 402 are equal.

[0052] In this embodiment, start the vacuum pumping mechanism 70, and the gas pumping port 701 connected with the vacuum chamber 10 can extract the gas in the vacuum chamber 10 to the outside of the vacuum chamber 10, thereby gradually reducing the air pressure in the vacuum chamber 10, until the desired vacuum is reached. In this process, as the degree of vacuum increases, the solubility of the organic solvent on the substrate 30 will gradually increase and reach saturation, and then as the residual organic solvent on the substrate 30 volatiliz...

Embodiment 2

[0054] Please refer to Figure 5 , this embodiment is the same or similar to Embodiment 1. For details, please refer to the above description of the vacuum drying device in Embodiment 1, which will not be repeated here. The difference between the two is:

[0055] The vacuum drying device also includes a moving mechanism 80, one end of the moving mechanism 80 is fixedly connected to the vacuum chamber 10, and the other end is connected to the first cooling mechanism 40, and the moving mechanism is used to control the first cooling mechanism 40. A cooling mechanism 40 moves.

[0056] The cooling device further includes a first cooling mechanism 40 disposed on at least one side around the platform 20 .

[0057] The cooling device includes first cooling mechanisms 40 disposed around and above the carrier 20 , and there is a gap between two adjacent first cooling mechanisms 40 .

[0058] In this embodiment, after the substrate 30 enters the vacuum chamber 10, alignment is carried...

Embodiment 3

[0062] Please refer to Figure 6 , this embodiment is the same or similar to the foregoing embodiment, please refer to the above description of the vacuum drying device in Embodiment 2 for details, and will not repeat them here, the difference between the two is:

[0063] A cavity 201 is formed inside the carrier 20 , and the cooling mechanism further includes a second cooling mechanism 60 , and the second cooling mechanism 60 is disposed in the cavity 201 inside the carrier 20 .

[0064] In this embodiment, a cavity 601 is formed inside the second cooling mechanism 60 , and the cavity 601 is filled with the cooling medium.

[0065] see Figure 7 , in this embodiment, the cross-section of the second cooling mechanism 60 may be plate-shaped. At this time, the second cooling mechanism 60 forms a projection on the stage 20, and the projection is from the central area of ​​the stage to the peripheral area. Gradually increase, and then the cooling area of ​​the substrate 30 incre...

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Abstract

The present application proposes a vacuum drying device, including a vacuum chamber, a stage located in the vacuum chamber, a cooling device and an adsorption mechanism, the stage is used to carry the substrate to be dried, and the cooling device includes a A first cooling mechanism, and a second cooling mechanism positioned inside or below the carrier, wherein a cavity is provided inside the first cooling mechanism, and a through hole communicating with the cavity is provided on the side facing the carrier . In this application, an adsorption mechanism is arranged inside the cooling mechanism, and a through hole communicating with the adsorption mechanism is provided on the side of the cooling mechanism facing the stage, and the remaining organic solvent volatilized on the substrate is adsorbed by the adsorption mechanism , so as to avoid the phenomenon of liquid droplets formed by organic solvents that cannot be eliminated.

Description

technical field [0001] The present application relates to the technical field of panel manufacturing, in particular to a vacuum drying device. Background technique [0002] Compared with liquid crystal display (LCD), organic electroluminescent device (OLED) has the advantages of self-luminescence, fast response, wide viewing angle, high brightness, bright color, light and thin, etc. It is considered to be the most promising new generation display technology. [0003] At present, the development trend of OLED is gradually moving towards the direction of inkjet printing, but in the process of inkjet printing, there are drying, baking, printing and other processes, and the printed film layer has at least three layers, which are hole injection layer , electron transport layer and light emitting layer. [0004] In the prior art, drying and baking are required after each printing. At present, the main purpose of drying is to solidify the shape of the film layer. Therefore, both ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56H01L27/32
CPCH10K59/10H10K71/135H10K71/00
Inventor 黄辉
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD