Adapter plate, circuit board and electronic equipment
An adapter board, circuit board technology, applied in the direction of electrical equipment structural parts, printed circuits, printed circuit parts, etc., can solve the problems of ineffective protection and heat dissipation of devices
Active Publication Date: 2020-03-27
VIVO MOBILE COMM CO LTD
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- Abstract
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Problems solved by technology
[0004] The embodiment of the present invention provides an adapter board, a circuit board and electronic equipment to solve the problem that the existing technology cannot effectively protect and dissipate heat from the devices in the circuit board
Method used
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[0028] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.
[0029] At present, electronic equipment in the prior art adopts stacked motherboards, and the adopted motherboard design scheme is to weld and connect two circuit board bodies through an adapter board, so that the components on the two circuit board bodies can realize electrical signal communication. The reason is that the current plastic packaging process needs to melt the plastic packaging material and then flow into the stacked main board, bu...
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The invention provides an adapter plate, a circuit board and electronic equipment, and relates to the technical field of communication. The adapter plate comprises an annular substrate, at least one layer of conductive connecting parts is arranged around the annular substrate, the number of each layer of conductive connecting parts is multiple, and the multiple conductive connecting parts are arranged in the annular substrate in a penetrating mode at intervals; and a plurality of gaps arranged between the conductive connecting parts, wherein the gaps comprise at least one of a groove and a through hole. In the scheme of the invention, at least one layer of conductive connecting part is arranged around the periphery of the annular substrate. The number of each layer of conductive connectingparts is multiple, the multiple conductive connecting parts are arranged in the annular substrate in a penetrating mode at intervals, and the multiple gaps are formed between the conductive connecting parts so that plastic packaging materials can be allowed to flow in, the whole circuit board can be further subjected to plastic packaging, and the problem that an adapter plate is prone to deformation at the high temperature can be solved.
Description
technical field [0001] The invention relates to the technical field of communication, in particular to an adapter board, a circuit board and electronic equipment. Background technique [0002] With the growth of user demands, more and more components are used in electronic equipment, and the volume of batteries is also increasing. However, the requirement of portability of electronic equipment limits the increase in the size of electronic equipment itself. [0003] At present, since the adapter board is only hollowed out in the middle, and the metal column part used for the electrical connection of the upper and lower motherboards is a closed ring structure and a solid plate, after adopting the structure of the adapter board, it is impossible to further plastic seal the entire motherboard, and then The devices in the stacked motherboard cannot be effectively protected and dissipated. Contents of the invention [0004] Embodiments of the present invention provide an adapte...
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IPC IPC(8): H05K1/14H05K7/20
CPCH05K1/144H05K7/205
Inventor 黎志冬
Owner VIVO MOBILE COMM CO LTD