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Power supply cooling apparatus, methods and arrangements

A technology for power supply and cooling components, applied in auxiliary devices, cooling/ventilation/heating transformation, circuits, etc., can solve expensive and complex problems

Active Publication Date: 2022-06-07
THE ESAB GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unfortunately, these techniques also require additional components to be included in the power supply and are more expensive and complex to implement than forced subsonic flow

Method used

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  • Power supply cooling apparatus, methods and arrangements
  • Power supply cooling apparatus, methods and arrangements
  • Power supply cooling apparatus, methods and arrangements

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Embodiment Construction

[0025] Presented herein are apparatus, arrangements, and methods for cooling components of a power supply. The apparatus, configurations and methods direct process gas (ie, operating gas) (eg, plasma gas) over and / or through heat transfer surfaces / objects in a power supply to cool electrical components (eg, resistors, capacitors, integrated circuits, computing components (eg microprocessors, etc.). That is, the power supply components typically used to deliver process gas to the torch assembly are modified / replaced so that as the process gas moves from the gas inlet port of the power supply to the gas outlet port of the power supply, the process gas travels through and / or through the heat transfer surface in the power supply. Thus, the device and configuration provides cooling without adding cooling-specific components to the power supply. Furthermore, the cooling provided by the process gas provides effective cooling and thus may replace or augment the cooling provided by t...

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Abstract

A cooling component suitable for cooling electrical components arranged in a power source of a welding system or a cutting system, comprising a heat transfer surface, an inlet, an outlet and a closed flow area. The heat transfer surface transfers heat away from the electrical component. The inlet receives process gas from the gas source, and the outlet directs the process gas downstream toward the torch assembly. A closed flow region extends between the inlet and the outlet and is in thermal communication with the heat transfer surface such that the process gas enhances cooling of the electrical component as it travels through the closed flow region from the inlet to the outlet. The present disclosure also relates to a power supply for a welding system or a cutting system and a method of cooling components in a power supply for a welding system or a cutting system.

Description

technical field [0001] The present disclosure relates to power supplies for welding and / or cutting systems, and in particular to apparatuses, methods and / or arrangements for cooling one or more components arranged within the power supplies for welding and / or cutting systems. Background technique [0002] Welding and cutting systems, such as plasma cutting systems, typically include multiple interconnected components. For example, a plasma cutting system may include a power source that interconnects the gas source, the torch assembly, and the fixture. Accordingly, electrical components (eg, resistors, capacitors, integrated circuits, computing components (eg, microprocessors) in the power supply may be manipulated / controlled (eg, in response to trigger signals, inputs at a control panel, etc.) during a welding or cutting operation. device), etc.) to control the gas supply and power supply to the torch assembly. However, these electrical components must be properly cooled in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K10/00
CPCB23K5/00B23K10/02B23K10/00B23K37/003H05K7/20918H05K7/20154H05K7/20163B23K9/1006H01L23/3672B23K9/32B23K9/16B23K9/013H01L23/473H05H1/28H05H1/36
Inventor A·雷蒙德
Owner THE ESAB GROUP