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Micro-LED chip, preparation method thereof and display device

A chip and light-emitting chip technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of unable to drive the backplane welding, etc., and achieve the effect of improving contact performance, avoiding falling off, and good contact

Active Publication Date: 2020-04-03
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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AI Technical Summary

Problems solved by technology

[0005] The present application provides a Micro-LED chip, its preparation method, and a display device, which are used to solve the problem that the electrode of the light-emitting chip in the Micro-LED chip and the electrode of the driving backplane cannot be effectively welded in the prior art

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  • Micro-LED chip, preparation method thereof and display device
  • Micro-LED chip, preparation method thereof and display device
  • Micro-LED chip, preparation method thereof and display device

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Embodiment Construction

[0040] Usually, when preparing a Micro-LED chip, due to the incompatibility of the process flow, it is necessary to separately prepare the light-emitting chip and the driving backplane included in the Micro-LED chip. After the light-emitting chip and the driving backplane are prepared, the electrodes of the light-emitting chip and the electrodes of the driving backplane can be connected to drive the light-emitting chip to emit light.

[0041] In the prior art, the electrodes of the light-emitting chip and the electrodes of the driving backplane are usually welded by a flip-chip welding process.

[0042] Specifically, such as figure 1 As shown, first, the solder 12 can be prepared on the electrodes 111 and 112 of the driving backplane 11; secondly, the light-emitting chip 13 is flipped, and the electrodes 131 and 132 of the light-emitting chip 13 are respectively connected to the electrodes 111 of the driving backplane 11. Align with the electrodes 112 ; finally, perform weldi...

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Abstract

The invention discloses a Micro-LED chip, a preparation method thereof and a display device, the Micro-LED chip comprises a driving backboard and a light-emitting chip, both the driving backboard andthe light-emitting chip comprise electrodes, a groove is formed above the electrode of the driving backboard, and the bottom of the groove is exposed to the electrode of the driving backboard; the groove is filled with metal, and the electrode of the driving backboard is connected with the electrode of the light-emitting chip through the metal in the groove. In a way of printing liquid metal, theelectrode of the light-emitting chip is connected with the electrode of the driving backboard through the cured liquid metal; compared with direct welding of the electrode of the driving backboard andthe electrode of the light-emitting chip, due to the fact that the contact performance of connection of the cured liquid metal is good, the contact performance between the electrodes can be effectively improved, and the reliability of connection between the electrodes is improved.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a Micro-LED chip, a manufacturing method thereof, and a display device. Background technique [0002] Micro-LED chip is a new type of display chip, which has the characteristics of self-illumination, thin shape, high efficiency, high brightness, high resolution, fast response time, etc., and is increasingly used in various display and lighting fields. [0003] Generally, a Micro-LED chip can include two parts: a light-emitting chip and a driving backplane. Due to the incompatibility of the process flow, the light-emitting chip and the driving backplane need to be prepared separately. After the light-emitting chip and the driving backplane are prepared, they can be The electrodes of the light-emitting chip and the electrodes of the driving backplane are welded to drive the light-emitting chip to emit light. [0004] However, in practical applications, due to the small ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62
CPCH01L33/62H01L2933/0066
Inventor 王建太韦冬杨小龙邢汝博
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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