An automatic alignment exposure equipment for inner layer dry film of hdi circuit board

Abstract

The invention relates to the field of circuit board processing, and in particular to automatic alignment exposure equipment for an inner dry film of an HDI circuit board. The automatic alignment exposure equipment comprises an exposure machine, and the automatic alignment exposure equipment further comprises a feeding assembly, an alignment assembly and a moving assembly. The feeding assembly is arranged at the front end of the exposure machine, the moving assembly is arranged on the lower half part of the exposure machine, and the moving assembly is located on one side of the feeding assembly. The alignment assembly is arranged at the top of the moving assembly, and the alignment assembly is located between the exposure machine and the feeding assembly. The feeding assembly comprises a material containing box, a material moving mechanism and a grabbing mechanism. The discharging box is arranged at the front end of the exposure machine, the material moving mechanism is arranged at thetop of the material placing box, the grabbing mechanism is arranged at the top of the material moving mechanism, and the grabbing mechanism is located between the exposure machine and the material placing box. The problem that accurate alignment cannot be achieved during circuit board alignment is solved, time is saved, the labor cost is reduced, and the alignment accuracy is improved.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to an automatic alignment exposure device for inner dry films of HDI circuit boards. Background technique [0002] With the continuous development of circuit boards towards lightness, thinness and shortness, the density of circuits continues to increase. At present, a considerable part of the exposure process of rigid boards uses automatic alignment exposure machines to ensure high efficiency and high precision. However, for the FPC that has recently appeared and developed rapidly For flexible circuit boards, because the board surface is relatively small compared to hard boards, it is generally equivalent to less than 1 / 4 of the area. The traditional automatic alignment exposure machine can only align one piece at a time, which is obviously not applicable. The current common method is to use manual alignment. Alignment, after alignment, put it into an ordinary exposure machin...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an automatic alignment exposure equipment for the inner layer dry film of HDI circuit boards, which solves the problem that the alignment of the circuit boards cannot be accurately aligned

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