Acquisition method of laser resistance trimming scheme, laser resistance trimming scheme and chip resistor
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A technology of laser resistance adjustment and acquisition method, which is applied to non-adjustable metal resistors, resistors, resistance manufacturing and other directions, can solve the problems of low resistance precision and low yield, and achieves the improvement of controllability, precision and yield. Effect
Active Publication Date: 2020-04-10
SHENZHEN JPT OPTO ELECTRONICS CO LTD
View PDF3 Cites 3 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0005] The first purpose of the present invention is to provide a method for obtaining a laser resistance adjustment scheme, so as to obtain a method that can solve the low resistance accuracy and low yield of the secondary resistance adjustment method commonly found in the current secondary resistance adjustment method to a certain extent. Laser Trimming Solution for Technical Problems
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0058] The method for obtaining a laser resistance trimming solution provided in this embodiment is used to obtain a laser resistance trimming method.
[0059] see figure 1 As shown, the method for obtaining the laser resistance trimming solution provided in this embodiment includes the following steps:
[0060] S100, cut the resistance to be adjusted for the first time with a serpentine knife edge, so that the resistance accuracy of the resistance to be adjusted can reach the predetermined accuracy, and the value range of the predetermined accuracy is 0.1%-1%;
[0061] S101, adjust the resistance to perform a second cut on the cutting edge;
[0062] S102, judging whether the resistance precision of the resistor to be adjusted reaches the target precision;
[0063] S103, if the resistance accuracy of the resistor to be adjusted reaches the target accuracy, determine the laser resistance adjustment solution as cutting the blank resistor with a serpentine edge and a counter-cu...
Embodiment 2
[0126] Embodiment 2 provides a laser resistance trimming solution, which includes the acquisition method of the laser resistance trimming solution in Embodiment 1, and the technical features of the laser resistance trimming solution acquisition method disclosed in Embodiment 1 are also applicable to this implementation For example, the technical features of the method for obtaining the disclosed laser resistance trimming solution in Embodiment 1 will not be described repeatedly.
[0127] The laser resistance trimming solution provided in this embodiment is obtained by the method for obtaining the laser resistance trimming solution provided in Embodiment 1.
[0128] Specifically, the laser resistance trimming solution includes the following steps:
[0129] S700, for the first cutting of the blank resistor with a snake-shaped knife edge, so that the resistance precision of the resistor to be adjusted can reach the predetermined precision;
[0130] S701, performing a second cut ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Login to view more
Abstract
The invention relates to the technical field of laser resistance trimming, in particular to an acquisition method of a laser resistance trimming scheme, the laser resistance trimming scheme and a chipresistor. The acquisition method of the laser resistance trimming scheme comprises the following steps that a to-be-trimmed resistor is subjected to primary cutting through a serpentine knife edge, so that the resistance value precision of the to-be-trimmed resistor reaches the preset precision, and the value range of the preset precision is 0.1%-1%; the to-be-trimmed resistor is subjected to secondary cutting through the cutter edge; it is judged whether the resistance precision of the to-be-trimmed resistor reaches the target precision or not; and if the resistance precision of the to-be-trimmed resistor reaches the target precision, it is determined that the laser resistance trimming scheme is that the blank resistor is cut by the serpentine knife edge and the bisection knife edge in sequence. The laser resistance trimming scheme is obtained by adopting the obtaining method of the laser resistance trimming scheme. The chip resistor is produced through the laser resistance adjustingscheme. According to the acquisition method of the laser resistance trimming scheme, the laser resistance trimming scheme and the chip resistor, the precision and the yield of the finished resistor can be improved.
Description
technical field [0001] The invention relates to the technical field of laser resistance trimming, in particular to a method for obtaining a laser resistance adjustment scheme, a laser resistance adjustment scheme and a chip resistor. Background technique [0002] The principle of laser trimming is to use a very thin laser beam to hit the thick and thin film resistors, and the resistor body is vaporized and evaporated to realize the cutting of thick and thin film circuits. By changing the conductive cross-sectional area of the resistors, the resistance accuracy is improved. [0003] In order to improve the resistance accuracy from 1% to 0.1%, laser repairing is usually performed by secondary resistance adjustment. After the first resistance adjustment operation, it is usually cut within the accuracy range of 1% to 1.5% of the target value, and then after the second resistance adjustment operation, it is cut within the accuracy range of 0.1% of the target value. [0004] Ho...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to view more 
Login to view more