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Beam Scanning Device for Laser Microhole Processing

A technology of microhole processing and beam scanning, applied in laser welding equipment, metal processing equipment, optics, etc. Hole processing and other issues

Active Publication Date: 2020-09-25
XIAN MICROMACH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main defects of the existing method are as follows: 1. During microhole machining, the processing of any inverted cone hole cannot be realized, such as the microhole machining on the fuel injector of an automobile; , can not meet the processing of micro-holes with large depth-to-diameter ratio

Method used

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  • Beam Scanning Device for Laser Microhole Processing
  • Beam Scanning Device for Laser Microhole Processing

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0009] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0010] As wrong! Reference source not found. and err! Reference source not found. A beam scanning device 100 for laser microhole processing shown includes a mounting plate 001, a reflection module, a deflection module 3, a translation module 4 and a focus module 5; the reflection module, the deflection module 3, the translation module 4 and the focus module 5 are all Set on the mounting plate 001, the reflection module i...

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Abstract

The invention discloses a light beam scanning device for laser micropore machining, which comprises a reflection module, deflection modules, translation modules and a focusing module. The reflection module comprises a first reflection sub-module and a second reflection sub-module. The number of the deflection modules and the number of the translation modules are both two. Shafts of the two deflection modules rotate relatively and are arranged between the first reflection sub-module and the second reflection sub-module. Each deflection module comprises an optical wedge assembly and a first direct drive motor used for driving the optical wedge assembly to rotate around a first axial direction. Shafts of the two translation modules rotate relatively and are arranged between the second reflector assembly and the focusing module. Each translation module comprises a flat plate assembly and a second direct-drive motor used for driving the flat plate assembly to rotate around a second axial direction. Thus, a large depth-to-diameter ratio and different taper hole machining can be realized.

Description

technical field [0001] The invention belongs to the technical field of laser fine microhole processing, in particular to a beam scanning device for laser microhole processing. Background technique [0002] Compared with traditional mechanical processing, laser processing has the following advantages: 1. No contact processing, no mechanical deformation; 2. High energy density of laser beam, fast processing speed, and small thermal deformation of workpiece; 3. High machinability Materials with high hardness, high brittleness and high melting point; 4. High production efficiency, stable and reliable processing quality, and good economic benefits. Laser processing provides a new processing method for the processing industry, and has advantages that traditional processing cannot match. With the continuous improvement of processing requirements, the scanning structure and method of laser processing are also continuously improved and upgraded. [0003] At present, there are many ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B26/10B23K26/06B23K26/382B23K26/70
CPCB23K26/0643B23K26/0648B23K26/382B23K26/702
Inventor 康伟王宁赵华龙赵荣昌
Owner XIAN MICROMACH TECH CO LTD