Thermal resistance test power adding device and method

Abstract

The invention provides a thermal resistance test power adding device and method. The device comprises Kelvin sub-circuits connected to each port of a tested device, a driving module, a power supply, apower current source, a thermal resistance measurement module, a power current measurement module and a timing module, wherein the driving module is used for providing a driving voltage or a drivingcurrent for the tested device through the Kelvin sub-circuit of a first port; the power supply provides a power voltage for the tested device through the Kelvin sub-circuits of a second port and a third port; the power current source is used for providing a power current for the tested device through a driving current line in the Kelvin sub-circuit of the third port; the thermal resistance measurement module is connected to the second port and the third port in parallel or connected to the first port and the third port in parallel, and is used for testing voltage values of the tested device before and after power is added; the power current measurement module is used for measuring a current value output by the power current source; and the timing module starts timing when the measured current value reaches a preset threshold current. In the invention, thermal power applied to the device is equal to a calculated value, an error is reduced, and thermal resistance test precision is improved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit testing, in particular to a thermal resistance testing power adding device and method. Background technique [0002] As a key parameter in the thermal design of power devices, thermal resistance is a must-test parameter for the mass production of power semiconductors. The mass production test method of power semiconductors usually adopts the test method of dynamic thermal resistance, which mainly utilizes the temperature-sensitive electrical junction in which the junction voltage changes with the temperature of the device under test. The main steps include establishing a small Current, measure the voltage value of the device under test, establish the voltage and current required to add power, start the timing, stop the timing after a period of time, and then establish the tiny current required for thermal resistance parameter measurement again and measure the power of the device under t...

AI Technical Summary

Problems solved by technology

In the current thermal resistance test equipment, the timing start time for calculating the power-on time is started synchronously with the current start-up time, without considering that the power current needs a certain settling time, so the actual thermal power added to the device under test will be less than the calculated value. lead to thermal resistance calculation errors

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