Unlock instant, AI-driven research and patent intelligence for your innovation.

Display device, and binding method of driver chip and array substrate

A technology for display devices and array substrates, applied in semiconductor/solid-state device components, semiconductor/solid-state device testing/measurement, semiconductor devices, etc. Accuracy, intuitive numerical value, high precision effect

Active Publication Date: 2022-08-02
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention provides a display device, and a method for binding a driving chip and an array substrate to solve the problem of existing display devices. Since the driving chip is opaque when binding the driving chip, the binding accuracy can only be measured through the array substrate. The bonding effect is measured on one side of the substrate, and the terminals on the array substrate are often larger than the terminals on the driver chip, so in the process of measuring the bonding offset, it is easy to misjudge the bonding effect.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Display device, and binding method of driver chip and array substrate
  • Display device, and binding method of driver chip and array substrate
  • Display device, and binding method of driver chip and array substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0030] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc., or The positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A display device and a method for binding a driver chip and an array substrate, comprising an array substrate and a driver chip aligned with the array substrate, a binding area is defined on the surface of the array substrate, and a plurality of first terminals are arranged at intervals in the binding area , a plurality of second terminals are arranged at intervals on the side of the driver chip close to the array substrate, the first terminals and the second terminals are one-to-one, and at least one first dummy terminal is also set in the binding area, and the first dummy terminal is connected to the The second terminals are aligned, the first dummy terminals and the second terminals have an overlapping surface, and the first dummy terminals partially cover the second terminals. By setting dummy terminals on the array substrate, the lateral and vertical displacement of the terminals on the driver chip and the dummy terminals can be judged, and then the binding effect between the array substrate and the driver chip can be judged. This measurement method has higher precision and numerical value. It is more intuitive, thereby improving the accuracy of judging the binding effect.

Description

technical field [0001] The present invention relates to the field of display technology, and in particular, to a display device and a method for binding a driver chip and an array substrate. Background technique [0002] Bonding technology usually refers to the process of combining a display panel with a chip. Generally, a display device includes a display panel and a display driving device welded on the display panel. The display driving device may include a flexible wiring substrate or a driving chip. The chip (IC) 20 is directly bonded to the bonding area on the display panel to provide driving signals. [0003] In general, due to the expansion and contraction of the driver chip in the later stage, the circuit breaker occurs. Therefore, whether it is a COP (Chip On PI) type or a COF (Chip On Film) type binding, the size of the terminals on the panel is designed to be larger than The size of the bump (bump) on the corresponding driver chip, but in this design, the bump wi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66H01L23/544
CPCH01L22/22H01L22/32
Inventor 胡鹏陈辉鹏
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD