Ultra-thick core board punching system and ultra-thick core board punching method

Abstract

The invention relates to an ultra-thick core board punching system and an ultra-thick core board punching method. The ultra-thick core board punching system comprises a first punching piece, a secondpunching piece and a milling tool piece. The first punching piece is used for conducting positioning punching on a core board. The milling tool piece conducts controlled depth milling on the core board. The core board is provided with a plurality of controlled depth areas through the milling tool piece. The second punching piece conducts punching in the controlled depth areas. For example, when the thickness of the core board is larger than 1 mm, the milling tool piece is used for conducting material milling operation firstly, in other words, the controlled depth areas are formed in the core board, and then the second punching piece is inserted in the controlled depth areas for further punching. According to the manner, the milling tool piece is used for conducting controlled depth treatment on the large-thickness core board with the thickness larger than 1 mm, it is guaranteed that the second punching piece punches the core board under the situation that the precision is guaranteed atthe time, it is guaranteed that two adjacent core boards can be accurately aligned during laminating, and the core board alignment precision is improved.

Description

technical field

[0001] The invention relates to the technical field of core plate processing, in particular to an ultra-thick core plate punching system and an ultra-thick core plate punching method. Background technique

[0002] With the rapid development of the electronics industry, the wiring of circuit boards is becoming more and more concentrated, and the distance between holes and conductors is getting smaller and smaller. At present, the commonly used alignment method when laminating multiple core boards is set pins, and set pins need Grooves or holes for set pins are machined on the core plate. However, the current punching equipment often punches conventional core boards (with a thickness of less than 1mm). , directly using punching equipment to punch the core board will cause punching errors, which will affect the overall interlayer alignment accuracy of the circuit board. Contents of the invention

[0003] Based on this, it is necessary to provide an ultra-thi...

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