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Stress sensor and its preparation method

A stress sensor and sensor model technology, applied in the field of measurement, can solve problems such as difficult signal analysis, many vibration components, and inability to obtain the response of material mechanical properties, so as to reduce noise interference, reduce vibration components, and facilitate the corresponding information of mechanical properties Effect

Active Publication Date: 2021-03-26
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, with the further increase of the loading rate, the structural vibration response of the sensor is inevitable. In fact, the vibration of the sensor is often formed by multi-mode superposition, coupled with other interference components such as noise, and the obtained measurement signal is mixed with more vibration components. , it is difficult to analyze the signal
Under a certain strain rate, it is basically impossible to obtain the mechanical characteristic response of the material.

Method used

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  • Stress sensor and its preparation method
  • Stress sensor and its preparation method
  • Stress sensor and its preparation method

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Embodiment Construction

[0040] In order to make the purpose, technical solution and advantages of the present application clearer, the stress sensor of the present application and its preparation method will be further described in detail through the following examples and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present application, not to limit the present application.

[0041] The serial numbers assigned to components in this document, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequence or technical meaning. The "connection" and "connection" mentioned in this application all include direct and indirect connection (connection) unless otherwise specified. In the description of this application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", The orientation or ...

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Abstract

The present application relates to a stress sensor and a preparation method thereof. The fixing part of the test piece has a central axis of symmetry, and one end of the clamping part is vertically fixed to the center of a surface of the fixing part of the test piece. The axis of the clamping portion passes through the central axis of symmetry. Therefore, the stress sensor as a whole forms an axisymmetric structure. Therefore, the single-mode vibration state can be guaranteed, and when the strain gauge is fixed at the fixed position of the strain gauge to obtain the measurement signal, the vibration component in the measurement signal can be reduced, which is convenient for signal analysis, improves the accuracy of the test, and reduces the signal Analyze the difficulty and improve work efficiency.

Description

technical field [0001] The present application relates to the field of measurement, in particular to a stress sensor and a preparation method thereof. Background technique [0002] The existing medium and high strain rate dynamic measurement sensor design only considers the low-order natural vibration frequency of the structure and the system damping ratio parameters. It is expected to increase the sensor’s natural frequency based on a simple sensor lightweight method, thereby preventing the structural ringing effect and ensuring signal accuracy. . However, with the further increase of the loading rate, the structural vibration response of the sensor is inevitable. In fact, the vibration of the sensor is often formed by multi-mode superposition, coupled with other interference components such as noise, and the obtained measurement signal is mixed with more vibration components. , it is difficult to analyze the signal. Under a certain strain rate, the mechanical characteris...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/22
CPCG01L1/2206
Inventor 应鹏飞陈文韬葛宇龙夏勇周青
Owner TSINGHUA UNIV