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Image sensors with grounded or otherwise biased channel stop contacts

An image sensor and contact technology, applied in the field of back-illuminated image sensors, can solve problems such as poor image quality, weakening, and weakening of MTF

Active Publication Date: 2021-08-03
KLA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, increasing the substrate thickness weakens the MTF at lower wavelengths by significantly increasing the depletion-free region in the substrate
This MTF weakening can lead to poor image quality at shorter wavelengths when the substrate is thick enough to allow imaging at longer wavelengths

Method used

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  • Image sensors with grounded or otherwise biased channel stop contacts
  • Image sensors with grounded or otherwise biased channel stop contacts
  • Image sensors with grounded or otherwise biased channel stop contacts

Examples

Experimental program
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Embodiment Construction

[0025] Reference will now be made in detail to various embodiments, examples of which are illustrated in the accompanying drawings. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of various described embodiments. It will be apparent, however, to one of ordinary skill in the art that each described embodiment may be practiced without these specific details. In other instances, well-known methods, procedures, components, circuits and networks have not been described in detail so as not to unnecessarily obscure aspects of the embodiments.

[0026] Figure 1Ais a plan view of a portion 100 of a pixel array in an image sensor. Section 100 includes a pair of pixel columns 101 - 1 and 101 - 2 and intervening channel stop layer 108 . The full pixel array includes a series of repeating pairs of pixel columns 101 , each pair of pixel columns 101 has a corresponding intermediate channel stop layer 108 therebe...

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PUM

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Abstract

The present invention discloses a back-illuminated image sensor, which includes: a first pixel; a second pixel; and a channel stop layer, which is located between the first pixel and the second pixel to isolate the first pixel from the second pixel. the second pixel. The channel stop layer includes a LOCOS structure and a doped silicon region below the LOCOS structure. The backside illuminated image sensor also includes a first conductive contact extending through the LOCOS structure and forming an ohmic contact with the doped silicon region. The first conductive contact may be grounded, negatively biased, or positively biased depending on the application.

Description

[0001] Related applications [0002] This application claims U.S. Provisional Patent Application No. 62 / 571,111, filed October 11, 2017, entitled "Novel Approach to Ground Return for Back-Illuminated ImagerSensors" application; December 1, 2017, titled "Adjustable Modulation-Transfer-Function (MTF) Through Top Contacts to LOCOS for Back-illuminated Image Sensors Through Top Contacts to LOCOS for Back -Illuminated Imager Sensors), U.S. Provisional Patent Application No. 62 / 593,559; and the December 1, 2017 application titled "Using Back-Illuminated Image Sensors from DUV to Near-IR with Tunable Modulation Transfer Function ( MTF)'s Multi-Spectral Inspection System (Multi-Spectral Inspection System From DUV To Near IR With Adjustable Modulation-Transfer-Function (MTF) Using Back-Illuminated ImagerSensors)" U.S. Provisional Patent Application No. 62 / 593,616 priority, the The entirety of the aforementioned application is hereby incorporated by reference for all purposes. technic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/148H01L27/146
Inventor 赖志诚振-华·霍华德·陈S·比耶拉克
Owner KLA CORP