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LED chip, display panel assembling equipment and assembling method

A technology of LED chips and assembly equipment, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of time-consuming and low efficiency of traditional solutions, and achieve the effects of convenient magnetic adsorption, reducing damage and improving efficiency

Inactive Publication Date: 2020-06-05
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The inventors of the present application found in the long-term research process that because the number of LED chips that need to be installed in the display panel is often large, it takes a lot of time to adopt the above-mentioned traditional solution, and the above-mentioned traditional solution has the problem of low efficiency

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  • LED chip, display panel assembling equipment and assembling method
  • LED chip, display panel assembling equipment and assembling method
  • LED chip, display panel assembling equipment and assembling method

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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0017] see figure 1 , figure 1 It is a structural schematic diagram of an embodiment of the LED chip of the present application. The LED chip 1 provided by this application can be an ordinary LED chip or a Micro-LED chip, and the LED chip 1 provided by this application can be a vertical structure (that is, the anode and cathode of the LED chip 1 are respectively located on the LED chip 1 opposite sides of the LED chip 1), or a lateral structure (that is, the...

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Abstract

The invention discloses an LED chip, display panel assembling equipment and an assembling method. The LED chip comprises a chip main body and a magnetic piece arranged on the chip main body, and the magnetic piece is arranged to allow the LED chip to be adsorbed under the action of magnetic adsorption force generated by an external transfer device. In the way, the assembling efficiency of the display panel can be improved.

Description

technical field [0001] The present application relates to the field of display technology, in particular to an LED chip, an assembly device and an assembly method of a display panel. Background technique [0002] With the development of technology, most display panels need to be equipped with multiple devices, for example, multiple LED chips, during the assembly process. The traditional method for arranging multiple LED chips is: use a mechanical device to grab the LED chips one by one, and place the LED chips one by one on a predetermined position in the receiving substrate. [0003] The inventors of the present application have found in the course of long-term research that since the number of LED chips that need to be installed in the display panel is often large, it takes a lot of time to adopt the above-mentioned traditional solution, and the above-mentioned traditional solution has the problem of low efficiency. Contents of the invention [0004] The technical probl...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L33/00
CPCH01L33/0095H01L21/683H01L21/6835H01L2221/68309H01L2221/68318H01L2221/68363H01L2221/68386H01L33/00H01L33/483H01L21/67709H01L21/67721H01L21/52H01L33/62H01L33/40
Inventor 郭双田文亚
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD