Indenter device and method for positioning flexible circuit board
A flexible circuit board and indenter technology, applied in electrical components, electrical components and other directions, can solve the problems of damage, easy movement of flexible circuit boards, etc., to reduce accidental damage, reduce yield drop phenomenon, and achieve the effect of positioning
Inactive Publication Date: 2021-07-13
HONGFUJIN PRECISION ELECTRONICS ZHENGZHOU +1
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Problems solved by technology
[0003] In view of this, it is necessary to provide a pressure head device and a method for positioning the flexible circuit board, aiming at solving the problem in the prior art that the flexible circuit board is easy to move and cause damage during the assembly process
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[0045] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.
[0046] In the description of the embodiments of the present invention, it should be noted that unless otherwise specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection ; It can be a mechanical connection, or an e...
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A pressure head device includes a base, a pressure head, an adsorption positioning part and a control part. A first negative pressure chamber, a first communication chamber and a second communication chamber are opened in the base. The suction positioning part includes a first suction nozzle and a second suction nozzle. An end of the first suction nozzle away from the base is coplanar with an end of the second suction nozzle away from the base. The control section includes a first control unit and a second control unit. In the smoothing mode, the first control unit establishes communication between at least one first negative pressure chamber and the first communication chamber, at least one first negative pressure chamber provides negative pressure to the first suction nozzle through the first communication chamber, so as to The first suction nozzle is adsorbed and positioned with one end of the flexible circuit board, the second control unit disconnects the communication between the first negative pressure chamber and the second communication chamber, and a positive pressure is formed in the second suction nozzle. Under the pressure of the second suction nozzle, the part of the flexible circuit board located between the first suction nozzle and the second suction nozzle is smoothed on the carrier platform. The invention also provides a method for positioning the flexible circuit board.
Description
technical field [0001] The invention relates to a pressure head device and a method for positioning a flexible circuit board. Background technique [0002] Flexible circuit boards are widely used in electronic devices due to their lightness, thinness and flexibility, and are used to transmit electronic signals between different components. During the assembly process of the electronic equipment, the flexible circuit board is easy to move relative to other components, which will lead to accidental contact and damage, which will lead to a decrease in the yield of the electronic equipment. Contents of the invention [0003] In view of this, it is necessary to provide an indenter device and a method for positioning the flexible circuit board, aiming at solving the problem in the prior art that the flexible circuit board is easily moved and caused damage during the assembly process. [0004] A pressure head device, used for absorbing the main body of a target object and smooth...
Claims
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IPC IPC(8): H05K13/00H05K13/04
CPCH05K13/0061H05K13/0409
Inventor 王静
Owner HONGFUJIN PRECISION ELECTRONICS ZHENGZHOU