Packaging structure

A packaging structure and packaging technology, applied in the field of packaging, can solve the problems of insufficient buffer protection, complex production process, product dysfunction, etc., to achieve better protection performance, improve production molding efficiency, and excellent protection performance.

Inactive Publication Date: 2020-06-19
GREE ELECTRIC APPLIANCES INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 2. It adopts ordinary tight-fitting white box packaging structure. Since the shell of this product is mostly made of plastic, some of them do not have buffer protection, or do not have all buffer protection
[0005] Among the above two packaging methods, Option 1 involves the cutting and molding of the sponge and gluing and fixing

Method used

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Experimental program
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Embodiment Construction

[0029] The present invention will be further described below in conjunction with the drawings.

[0030] Please refer to figure 1 with image 3 , The packaging structure of the present invention includes an integrally formed folding board group, which is used to form a box body that cushions and protects the packaged parts after folding. The folding board group includes: a side panel group 10, which is in a folded state Form a cavity 50 (such as image 3 (Shown), the cavity 50 is used to place the packaged parts; the top closure panel group 20 is connected to the side panel group 10 and seals the upper opening of the cavity 50 in the folded state of the side panel group 10; the bottom panel group 30, Connect the side panel group 10 and seal the lower opening of the cavity 50 in the folded state of the side panel group 10; and the inner liner board group 40, connect the sealing bottom plate group 30 and set in the folded state of the side panel group 10 Inside the cavity 50, it is ...

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Abstract

The invention relates to the technical field related to packaging, and provides a packaging structure. The packaging structure comprises an integrally-formed folding plate set, the folding plate set is folded to form a packaging structure body protecting a packaged part, and the folding plate set comprises a side surrounding plate set, a top sealing plate set, a bottom sealing plate set and a lining plate set; the side surrounding plate set can form a cavity channel in a surrounding mode, and the cavity channel is used for placing the packaged part; the top sealing plate set is connected withthe side surrounding plate set and used for sealing an upper opening of the cavity channel; the bottom sealing plate set is connected with the side surrounding plate set and used for sealing a lower opening of the cavity channel; and the lining plate set is connected with the bottom sealing plate set, can be contained in the cavity channel, and is provided with a placement opening used for supporting the packaged part, and the placement opening limits the side wall of the packaged part. The packaging structure has the advantages of fast forming, good buffer protection performance, saving and environmental protection.

Description

Technical field [0001] The present invention relates to the technical field of packaging, in particular to a packaging structure. Background technique [0002] For smart single-product products that are similar to round and light weight, most of these products use plastic materials as the shell, and the internal structure is mainly circuit board components. Generally, this type of product does not come with a metal plug. The main packaging methods are as follows: [0003] 1. The packaging box with top cover is used, and the inner lining of the package is independently designed. The inner lining is usually made of sponge, blister molding or other paper materials. Sometimes, for cushioning and protection, the top will also be lined with sponge. [0004] 2. It adopts ordinary tight-fitting white box packaging structure. Because the product shell is mostly plastic, some buffer protection is not used, or all buffer protection is not used. [0005] Among the above two packaging and packagi...

Claims

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Application Information

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IPC IPC(8): B65D5/02B65D5/50
CPCB65D5/02B65D5/5021
Inventor 罗大旺黄倬莹曹丽君莫东燕杨洋
Owner GREE ELECTRIC APPLIANCES INC
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