Flip chip testing method and system

Abstract

The invention relates to a flip chip testing method and system. The method comprises the following steps of acquiring calibration square sheets of N flip chips with different wavelengths, respectivelyobtaining a first group of brightness values and a second group of brightness values of the N flip chips through a flip machine table and a forward machine table, obtaining brightness ratios of the first brightness values to the second brightness values corresponding to the N flip chips and an average value of the brightness ratios, obtaining a first correction value of the brightness of the flipchip of which the wavelength is a first numerical value, acquiring a third brightness value of any flip chip of which the wavelength is the first value, and obtaining a first actual brightness valueof the flip chip of which the brightness is the third brightness value according to the product of the third brightness value, the arithmetic mean value and the first correction value, N being an integer greater than or equal to 2. By means of the method, the brightness test value of the forward machine table can be corrected, then the purpose of testing the brightness value of the flip product through the forward machine table is achieved, the utilization rate of the forward machine table is increased, and the production cost is reduced.

Description

Technical field [0001] The present invention relates to the field of optoelectronic technology, in particular to a flip-chip test method and a flip-chip test system. Background technique [0002] The traditional flip chip has the characteristics of its own structure. The backside of the chip is light. The use of a front-mounted test machine cannot accurately test the chip parameters. Only the flip-chip test machine can be used for testing. At the same time as the use of the front-mounted test machine and the flip-chip test machine Compared with chip testing, the test chip has lower efficiency and higher test cost. Summary of the invention [0003] Based on this, it is necessary to provide a new flip-chip test method and a new flip-chip test system in response to the above problems. [0004] A method of flip chip testing includes: [0005] Obtain calibration squares of N flip-chips with different wavelengths; [0006] After separately testing the brightness of the N flip chips using a...

AI Technical Summary

Problems solved by technology

[0002] Due to the characteristics of the structure of the traditional flip chip, the light is emitted from the back side, and the chip parameters cannot be accurately tested by using the front-mounted test machine. Only the flip-chip test machine can be used for testing. Compared with chip testing, the efficiency of testing chips is lower, and the testing cost is higher

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