A Measuring System and Measuring Method Considering Focusing, Leveling and Precise Alignment

Abstract

The invention discloses a measurement system and a measurement method that take into account both focusing, leveling and precise alignment. The characteristic of this system is that the dark field Moire fringe alignment deviation detection function and the chirped grating gap detection function are integrated into a set of detection units. The measurement system that takes into account alignment, focus and leveling realizes the integrated structure of the vertical measurement system and the horizontal measurement system, reduces the space requirement of the whole system of the lithography machine, and saves the space occupancy rate of the lithography machine . The measurement method of the measurement system that takes into account both alignment and focus adjustment and leveling realizes the focus adjustment, leveling and alignment of the substrate, and improves the working efficiency of the photolithography machine.

Description

technical field [0001] The invention relates to the field of lithography machines, in particular to a measurement system and a measurement method thereof that take into account both focusing, leveling, and precision alignment, and a lithography machine based on the measurement system and the measurement method thereof. Background technique [0002] In the production process of semiconductor chips, in order to achieve the desired accuracy index, it is necessary to accurately establish the relationship between the various coordinate systems of the lithography machine, so that the mask, objective lens, and wafer stage can establish a unified positional relationship. Usually, these devices are equipped with one or more sets of vertical detection systems, which are used to adjust the focus and level the substrate under test before aligning the mask with the substrate. On the one hand, to ensure that the substrate is in the imaging of the mask On the other hand, when the substrate...

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a measurement system and measurement method that takes into account both focus adjustment, leveling and precision alignment, so as to solve the problems caused by the independent vertical and horizontal detection systems in the existing photolithography machines. For the problem of high space occupancy of lithography machines, the present invention also provides a measurement method to solve the problems caused by the prior vertical measurement of the existing lithography machines, focusing and leveling the workpieces to be measured, and then aligning the workpieces. The problem of long production time and low yield of lithography machine

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