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Plastic packaging mold and method based on one-time double-side plastic packaging technology and mold cleaning method of mold

A plastic sealing mold, double-sided technology, applied in the secondary processing of printed circuits, electrical components, printed circuits, etc., can solve the problem that double-sided plastic sealing molds cannot solve the problems of plastic sealing overflow and mold cleaning at the same time, so as to improve the cleaning efficiency. , the effect of improving yield

Inactive Publication Date: 2020-07-10
HUANWEI ELECTRONICS SHANGHAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention will solve the technical problem that the existing double-sided plastic sealing mold cannot solve the plastic sealing overflow and mold cleaning at the same time, and provides a plastic sealing mold based on one-time double-sided plastic sealing technology, a plastic sealing method and a mold cleaning method

Method used

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  • Plastic packaging mold and method based on one-time double-side plastic packaging technology and mold cleaning method of mold
  • Plastic packaging mold and method based on one-time double-side plastic packaging technology and mold cleaning method of mold
  • Plastic packaging mold and method based on one-time double-side plastic packaging technology and mold cleaning method of mold

Examples

Experimental program
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Effect test

Embodiment 1

[0050] Such as figure 1 As shown, a double-sided plastic sealing mold is used for one-time plastic sealing of a double-sided PCB board 30, including an upper mold 10 and a matching lower mold 20, and the outer edges of the upper mold 10 and the lower mold 20 are pressed together, and the upper mold 10 and the lower mold 20 are pressed together. The mold 10 is provided with a first groove 11, and the lower mold 20 is provided with a second groove 23. When the upper mold 10 and the lower mold 20 are molded together, the first groove 11 and the first surface of the PCB board 30 to be packaged A first cavity is formed between the regions, and a second cavity is formed between the second groove 23 and the region to be packaged on the second surface of the PCB 30 . The contours of the outer edges of the upper mold 10 and the lower mold 20 are consistent to ensure that when the upper mold 10 and the lower mold 20 are closed, the position of the pressed PCB board 30 is corresponding, ...

Embodiment 2

[0059] On the basis of Embodiment 1, in order to solve the problem of excessive suction force of the vacuum hole 22, the vacuum hole 22 can be set in a variable-diameter shape instead of a cylindrical shape with a single hole diameter, and the smallest hole diameter of the vacuum hole 22 is located at the suction part 21 surfaces. Such as figure 1 As shown, the vacuum hole 22 is made up of a first cylindrical section and a connected conical section, the end of the first cylindrical section away from the conical section is flush with the outer surface of the lower die 20, and the first cylindrical section extends upwards to The larger opening end of the tapered section and the smaller opening end of the tapered section are flush with the surface of the suction part 21 . When clearing the mold, the top of the thimble 40 can move along the tapered inner wall of the tapered section to the surface of the suction part 21 to block the vacuum hole 22 . The design of the first cylind...

Embodiment 3

[0061] On the basis of Embodiment 1, the vacuum hole 22 is composed of three sections: comprising a first cylindrical section, a conical section and a second cylindrical section, the first cylindrical section is connected to the smaller opening end of the conical section, and the second cylindrical section is connected to the smaller opening end of the conical section. The two cylindrical sections are connected to the larger open end of the tapered section, so that the tapered section is located between the first cylindrical section and the second cylindrical section, and the aperture of the second cylindrical section is larger than that of the first cylindrical section. aperture. Before plastic sealing, when the top of the thimble 40 is moved below the smaller opening end of the tapered section, the vacuum hole 22 is evacuated. When the top of the thimble 40 moves to the second cylindrical section, the vacuum suction is the largest; when the top of the thimble 40 moves to the...

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Abstract

The invention provides a plastic packaging mold and method based on a one-time double-side plastic packaging technology and a mold cleaning method of the mold. The double-side plastic packaging mold is used for plastic packaging of a double-side PCB with one side including a non-packaging area and comprises an upper mold, a lower mold matched with the upper mold and ejection pins; the outer edge of the upper mold and the outer edge of the lower mold are press-fitted; vacuum holes are formed in the lower mold and are used for sucking the non-plastic-packaging area of the double-side PCB duringplastic packaging; and the ejection pins are arranged in the vacuum holes and can slide up and down along the inner walls of the vacuum holes. During plastic packaging, the ejection pins are moved tothe positions where vacuum pumping can be performed on the vacuum holes, so that the problem of glue overflowing can be avoided in the non-plastic-packaging area of the PCB; and during mold cleaning,the top ends of the ejection pins are moved to openings in the upper ends of the vacuum holes to block the vacuum holes, so that mold cleaning glue cannot block the vacuum holes, use of the mold for the next time is facilitated, and meanwhile, the mold cleaning efficiency is further improved.

Description

technical field [0001] The invention relates to the technical field of plastic sealing, in particular to a plastic sealing mold based on the one-time double-sided plastic sealing technology, a plastic sealing method and a mold cleaning method thereof. Background technique [0002] In one-time double-sided plastic packaging technology, in order to solve the problem of signal output, a non-packaging area will be reserved when designing the product to place the antenna to achieve signal output. Since this area is asymmetrical to the opposite side and there is no pressing surface, the plastic sealant will flow to this area during plastic sealing, causing the pad to be blocked, resulting in the inability to install the antenna in the subsequent process, and affecting the normal production of the product. The existing solution is to open a vacuum hole on the mold corresponding to the non-encapsulation area, and evacuate the vacuum hole to attach the non-encapsulation area of ​​the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/14B29C45/26B29C45/34B29C45/17B29C33/72H05K3/28
CPCB29C45/14336B29C45/26B29C45/34B29C45/1753B29C33/72H05K3/28H05K2203/1305
Inventor 蔡世涛罗伯特·加西亚
Owner HUANWEI ELECTRONICS SHANGHAI CO LTD
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