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Preparation method of polyimide film containing benzimidazole structure

A polyimide film and benzimidazole technology, applied in the field of polyimide preparation, can solve the problems of low strength and modulus, achieve low cost, expand the application range, and facilitate processing

Active Publication Date: 2020-07-10
江苏环峰电工材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the method in the above-mentioned patent improves the heat resistance of polyimide to a certain extent, the glass transition temperature of the obtained polyimide is mostly below 400°C, and its strength and modulus are low

Method used

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  • Preparation method of polyimide film containing benzimidazole structure
  • Preparation method of polyimide film containing benzimidazole structure
  • Preparation method of polyimide film containing benzimidazole structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] (X in the structural formula in this embodiment 1 、X 2 , Y 1 and Y 2 both -H)

[0055] The preparation method of the diamine monomer of benzimidazoles, basic steps are as follows:

[0056] (1) The molar ratio is 1:1:20 The compound of structural formula such as formula (I) is prepared by one-step reaction with methanol, the reaction temperature is 20°C, and the time is 48h;

[0057] (2) Carry out partial reduction reaction (partial reduction reaction refers to only the nearest -NH- - NO 2 Revert to -NH 2 reaction), the temperature of the partial reduction reaction is 40°C, and the time is 48h;

[0058] (3) The partial reduction product of the compound of the structural formula such as formula (I), ethylene dichloride, the compound of the structural formula such as formula (II) and triethylamine with a molar ratio of 1:20:1:5 are first substituted Reaction, the temperature of the substitution reaction is 20 ° C, the time is 48h, and then adding potassium fluori...

Embodiment 2

[0065] (X in the structural formula in this embodiment 1 、X 2 , Y 1 and Y 2 Respectively -CH 3 , -H, -CH 3 and -H)

[0066] The preparation method of the diamine monomer of benzimidazoles, basic steps are as follows:

[0067] (1) The molar ratio is 1:1:30 The compound of structural formula such as formula (I) is obtained by one-step reaction with methanol, the reaction temperature is 40°C, and the time is 25h;

[0068] (2) carry out partial reduction reaction (partial reduction reaction refers to only the -NH-nearest- NO 2 Revert to -NH 2 The reaction), the temperature of the partial reduction reaction is 60 ℃, and the time is 30h;

[0069] (3) After mixing the partial reduction product of the compound of the formula (I), dichloromethane, the compound of the formula (II) and diisopropylethylamine with a molar ratio of 1:40:2:8, Carry out a substitution reaction, the temperature of the substitution reaction is 50°C, and the time is 15h, and then add sodium fluoride ...

Embodiment 3

[0076] (X in the structural formula in this embodiment 1 、X 2 , Y 1 and Y 2 Respectively -CH 2 CH 3 , -H, -CH 3 and -H)

[0077] The preparation method of the diamine monomer of benzimidazoles, basic steps are as follows:

[0078] (1) The molar ratio is 1:1:45 The compound of structural formula such as formula (I) is prepared by one-step reaction with methanol, the reaction temperature is 80°C, and the time is 8h;

[0079] (2) carry out partial reduction reaction (partial reduction reaction refers to that only the -NO closest to -NH- 2 Revert to -NH 2 The reaction), the temperature of the partial reduction reaction is 70 ℃, and the time is 10h;

[0080] (3) The partial reduction product of the compound of the structural formula such as formula (I), tetrahydrofuran, structural formula such as the compound of formula (II) and pyridine that the molar ratio is 1:60:4:10 first carry out substitution reaction after mixing, the substitution reaction The temperature is 60°C...

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Abstract

The invention relates to a preparation method of a polyimide film containing a benzimidazole structure, the raw materials comprise a diamine monomer, the diamine monomer is a benzimidazole diamine monomer, and the structural general formula is shown in the specification, and X1, X2, Y1 and Y2 are selected from one of -F,-H,-CH3,-CH2CH3,-CH2CH2CH3 or -CH(CH3)2. The preparation method of the polyimide film containing the benzimidazole structure is simple, easy to implement and low in cost, the heat resistance and solubility of the polyimide film can be remarkably improved, and the application range of the polyimide film is expanded.

Description

technical field [0001] The invention belongs to the technical field of polyimide preparation, and relates to a preparation method of a polyimide film containing a benzimidazole structure. Background technique [0002] In order to meet the current demand for high-temperature-resistant high-performance polymer materials in the aerospace and electronics industries, organic polymer materials such as polyimide, polyamide, polyamide-imide, and polyurea have developed rapidly. Among them, diamine compounds are important raw materials for the synthesis of such polymers. In consideration of improving the heat resistance of materials, aromatic heterocyclic groups with good thermal stability are introduced into the polymer structure. Due to the strong rigidity of the aromatic heterocyclic group and the strong force between the molecular chains, the introduction of the aromatic heterocyclic group into the main chain of the polymer can improve its heat resistance. [0003] Patent CN101...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C07D235/18C08J5/18C08L79/08
CPCC08G73/1085C08G73/1039C08J5/18C07D235/18C08J2379/08
Inventor ZHANG ZHENYU
Owner 江苏环峰电工材料有限公司
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