Die bonder with glue brushing device
A crystal bonding machine and glue brushing technology, which is applied in the direction of conveyor objects, transportation and packaging, and electric solid devices, can solve the problems that the glue brushing mechanism and the crystal bonding mechanism cannot work continuously, and the chip packaging efficiency is low, so as to shorten the waiting time The effect of improving the packaging efficiency
Active Publication Date: 2020-11-13
SHENZHEN XINYICHANG TECH CO LTD
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Problems solved by technology
[0003] The purpose of the embodiment of the present application is to provide a die bonding machine with a glue brushing device to solve the problem in the related art that the glue brushing mechanism and the die bonding mechanism cannot work continuously, resulting in low chip packaging efficiency
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specific Embodiment approach
[0057] In one example, see Figure 15 , as a specific implementation of the crystal bonding machine with a glue brushing device provided in this application, the crystal ring moving assembly 312 includes an adapter plate 3121 for carrying the crystal ring, and a crystal ring rotation for driving the adapter plate 3121 to rotate The power unit 3122, the crystal ring transverse movement power unit 3123 for driving the adapter plate 3121 to move laterally and the crystal ring longitudinal movement power unit 3124 for driving the adapter plate 3121 to move vertically; the crystal ring longitudinal movement power unit 3124 is installed on the machine On frame 1, crystal ring lateral movement power unit 3123 is installed on crystal ring vertical movement power unit 3124, crystal ring rotation power unit 3122 is installed on crystal ring lateral movement power unit 3123, crystal ring rotation power unit 3122 and adapter plate 3121 connected. With this structure, the crystal ring tra...
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The invention provides a die bonder with a glue brushing device. The die bonder comprises a glue brushing mechanism, a die bonding mechanism and a material moving mechanism. The glue brushing mechanism comprises a glue brushing feeding assembly, a glue brushing assembly and a detection assembly; the die bonding mechanism comprises a die bonding feeding assembly and a die bonding assembly. The material moving mechanism comprises a transition material moving assembly, a glue brushing material moving assembly and a die bonding material moving assembly. With application of the transition materialmoving assembly, the support conveyed by the glue brushing material moving assembly can be transferred to the die bonding material moving assembly, and the die bonding material moving assembly can transfer the support after glue brushing to the die bonding position of the die bonding assembly for die bonding. When the glue brushing material moving assembly completes the support transportation task, the glue brushing material moving assembly can return to the initial position to realize the glue brushing operation of the next support; the die bonding material moving assembly can continuously move the support on the transition material moving assembly to the die bonding assembly so that alternate continuous operation of the glue brushing assembly and the die bonding assembly can be realized,glue brushing and die bonding operations are uninterrupted, the waiting time of the glue brushing mechanism and the die bonding mechanism is effectively shortened and the packaging efficiency of thechip can be improved.
Description
technical field [0001] The application belongs to the field of chip packaging equipment, and more specifically relates to a crystal bonding machine with a glue brushing device. Background technique [0002] In the field of chip packaging, the crystal bonding machine mainly includes a glue brushing mechanism for brushing the bracket, a crystal bonding mechanism for bonding the chip to the glue brushed bracket, and a glue brushing mechanism for removing the bracket from the glue brushing mechanism. The material transfer mechanism that transfers to the crystal bonding position of the crystal bonding mechanism. Among them, the glue brushing mechanism includes a glue brushing feeding assembly for supplying the bracket and a glue brushing assembly for carrying out glue brushing on the bracket; The bracket after brushing the glue is used for the die-bonding component of the die-bonding operation. The specific operation process of the crystal solid machine is as follows: the glue ...
Claims
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IPC IPC(8): H01L21/677H01L21/60H01L21/50
CPCH01L21/50H01L21/67703H01L21/67706H01L21/67721H01L24/743H01L24/75H01L2224/743H01L2224/7515H01L2224/7565
Inventor 胡新荣
Owner SHENZHEN XINYICHANG TECH CO LTD