A two-degree-of-freedom swing platform based on stick-slip principle

Abstract

The invention discloses a two-degree-of-freedom swing platform based on the stick-slip principle, and aims to provide a swing platform with large stroke, low control difficulty and high adjustment precision. The Y-direction swing platform is installed on the base through the Y-direction motion precision arc guide rail, and the X-direction swing platform is installed on the Y-direction swing platform through the X-direction motion precision arc guide rail; the stator module is installed on the base; the friction plate is installed on the On the top of the stator module, the lower end of the X-direction swing platform is provided with a spherical boss in contact with the friction plate, and the friction plate and the spherical boss form a kinematic pair; the stator is driven by an X-direction piezoelectric ceramic driver and a Y-direction piezoelectric ceramic driver The module uses the dynamic and static friction between the friction plate and the contact surface of the spherical boss to alternately realize the step displacement, and the X-direction swing platform performs two degrees of freedom swings in the X-direction and Y-direction relative to the base. The platform can realize motion decoupling in X and Y directions, and has the characteristics of large stroke, high resolution, high precision and low manufacturing cost.

Description

technical field [0001] The invention relates to the field of micro-operation technology, and more specifically, relates to a two-degree-of-freedom swing platform based on the principle of stick-slip. Background technique [0002] With the rapid development of microelectronics, life science and robot technology, higher requirements are put forward for micro-operation and micro-assembly technology, especially in chip manufacturing and packaging in the manufacturing process of large-scale integrated circuits, and micro-electronics in microelectronic systems. Production and assembly of nanocomponents, cell movement and separation in biomechanical engineering, precision measurement and precision machining in precision engineering, etc. In the above fields, the positioning and alignment problems of micro-assembly are often encountered. During the operation, not only the position of the assembly object must be adjusted, but also the placement angle of the assembly object must be ad...

AI Technical Summary

Problems solved by technology

If the angle deviation is too large during the micro-assembly process, it will be unable to adjust

And due to the addition of a displacement amplification mechanism, its displacement resolution is low

In addition, since the swings in the X and Y directions are coupled, the precise movement in the X and Y directions must be realized by means of kinematic decoupling, and the positioning operation is difficult

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