Optical module packaging device
A technology for packaging devices and optical modules, which is applied in the directions of optics, light guides, optical components, etc., can solve the problems of increased error and low lens installation accuracy, and achieve the effects of reducing the impact of packaging accuracy, reducing the range of movement, and reducing errors Effect
Active Publication Date: 2020-09-25
SONT TECH (SHEN ZHEN) LTD +1
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
However, the lens is so easy to increase the error during the movement, which leads to a large change in the bonding position of the lens and the installation position determined by the coupling when the lens is bonded to the circuit board, resulting in low mounting accuracy of the lens.
Method used
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[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0032] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the relationship between the components in a certain posture. If the specific posture changes, the directional indication will also change accordingly.
[0033] In addition, if there are descriptions involving "first", "second" and so on in the...
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The invention discloses an optical module packaging device. The optical module packaging device comprises a base, a placing seat, a material taking piece and a glue containing piece, wherein the placing seat is arranged on the base, the placing seat is used for fixing a circuit board of an optical module, the material taking piece is arranged on the base and used for taking a lens and installing the lens on the circuit board, the glue containing piece is provided with a glue containing groove used for containing bonding glue, the glue containing piece is movably installed on the base, and theglue containing groove is provided with a first position located under the material taking piece and a second position away from the first position in the horizontal direction. The optical module packaging device is advantaged in that in the process that the glue containing piece moves relative to the base, the glue containing groove can move back and forth between the first position and the second position, when the glue containing groove is located at the first position, and the material taking piece can clamp the lens to downwards coat the interior of the glue containing piece with bondingglue; influence of the dispensing process on the packaging precision of the lens can be reduced.
Description
technical field [0001] The invention relates to the technical field of optical module packaging, in particular to an optical module packaging device. Background technique [0002] The optical module is a core device of optical communication, which is used to realize the conversion of optical signal and electrical signal. When the optical module is assembled, one of the processes is to bond the lens to the circuit board of the optical module. In the current optical module packaging device, the dispensing mechanism is arranged above the fixture. In the packaging process, the optical path coupling of the lens on the circuit board is generally carried out first. After the coupling is completed and the installation position of the lens is determined, the fixture needs to drive the lens to shift along the horizontal direction and the up and down direction together to provide the dispensing mechanism in the circuit. Provide avoidance space when dispensing glue on the board to avo...
Claims
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IPC IPC(8): G02B6/42
CPCG02B6/4202G02B6/4251
Inventor 邓高文章林华郭利伟杨小飞
Owner SONT TECH (SHEN ZHEN) LTD