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A micro-led mass transfer method and transfer device

A transfer method and transfer device technology, applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as poor flexibility, achieve short time intervals, high efficiency, and avoid adverse thermal effects

Active Publication Date: 2020-11-10
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantage of this solution is that it can effectively avoid the wrong release of the wafer caused by laser irradiation on the wrong position, but the disadvantage is that it needs to make an opaque pattern according to the release distance of the wafer, which is less flexible.

Method used

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  • A micro-led mass transfer method and transfer device
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  • A micro-led mass transfer method and transfer device

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Embodiment Construction

[0026] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0027] refer to Figure 1 to Figure 4 As shown, a Micro-LED mass transfer method in this embodiment includes the following steps:

[0028] Transfer preparation: the light-transmitting substrate 4 is placed above the target substrate 5, the lower surface of the light-transmitting substrate 4 is coated with a photosensitive adhesive layer 7, and the Micro-LED chip 10 to be transferred is adhered to the lower surface of the photosensitive adhesive layer 7 ;

[0029] Alignment selection: adjust and align the longitudinal positions of the transparent substrate 4, the imaging lens 3 and the spatial light modulator 2, and align the position of the Micro-LED wafer 10 to be released on the transparent substrate 4 with the Micro-LED wafer to be received on the target substrate 5 10 position;

[0030] Illum...

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Abstract

The invention discloses a Micro-LED mass transfer method and a transfer device. The Micro-LED mass transfer method comprises the steps of transfer preparation: placing a light-transmitting substrate above a target substrate; selectively aligning: aligning the position of the to-be-released wafer of the light-transmitting substrate with the position of the to-be-received wafer of the target substrate; light release: starting a light source to emit a light beam , inputting the light beam into a spatial light modulator, enabling the controller to output a signal to the spatial light modulator, enabling the spatial light modulator to generate a real-time digital mask, enabling the spatial light modulator to convert the received light beam into a light spot array and output the light spot arrayto the light-transmitting substrate, enabling the light spot array to act on a photosensitive bonding layer to reduce the adhesion effect thereof, and enabling a wafer to be released to fall to a corresponding position of the target substrate; and carrying out continuous releasing. According to the Micro-LED mass transfer method and transfer device, effective release of the wafer of the light-transmitting substrate is achieved, and adverse thermal influence of a conventional laser heating stripping method on the wafer or the light-transmitting substrate is avoided.

Description

technical field [0001] The invention relates to the field of semiconductor optoelectronics, in particular to a Micro-LED mass transfer method and a transfer device. Background technique [0002] LED is a semiconductor electronic component that can emit light. It has the advantages of high energy conversion efficiency, short reaction time, and long service life. Micro-LED is obtained by thinning, miniaturizing, and arraying the traditional LED structure. 1~10μm. Due to the advantages of LED display technology, Micro-LED is increasingly used in display applications. However, the manufacturing process of ultra-high-resolution Micro-LED displays still restricts the application of Micro-LEDs to the above-mentioned purposes. Compared with OLED, a large-area light-emitting surface can be easily produced by cheap production methods such as printing, and a large-size, high-resolution Micro-LED display requires millions or tens of millions of micron-sized Micro-LEDs. Chips are arra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/15H01L21/67H01L21/683
CPCH01L21/67144H01L21/6836H01L27/156H01L2221/68363
Inventor 陈新陈云施达创崔成强侯茂祥汤晖高健刘强贺云波陈新度杨志军
Owner GUANGDONG UNIV OF TECH