Substrate for transparent conductive film and transparent conductive film

A transparent conductive, thin-film technology, applied to the direction of the conductive layer on the insulating carrier, can solve the problems of whitening, curling, cracks, etc., and achieve the effects of whitening and crack suppression, and small phase difference in the plane

Pending Publication Date: 2020-08-07
NITTO DENKO CORP
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conventional transparent conductive films sometimes suffer from curling, whitening and / or cracking

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate for transparent conductive film and transparent conductive film
  • Substrate for transparent conductive film and transparent conductive film
  • Substrate for transparent conductive film and transparent conductive film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0143] 1-1. Production of polycarbonate resin film

[0144] The product name "Iupizeta (registered trademark)" (Tg: 174° C.) manufactured by Mitsubishi Gas Chemical Co., Ltd., which is a polycarbonate resin, was vacuum-dried at 120° C. for 5 hours, and then dried using a single-screw extruder (Isuzu Kakoki film production system, screw diameter 25mm, barrel set temperature: 295°C), T die (width 200mm, set temperature: 295°C), cooling roll (set temperature: 140~150°C) and coiler device to produce a polycarbonate resin film with a thickness of 100 μm.

[0145] 1-2. Preparation of base material for transparent conductive film

[0146] The polycarbonate resin film obtained above was simultaneously biaxially stretched twice in each of the longitudinal direction and the width direction. The stretching temperature is [Tg+25°C]. In this way, a substrate for a transparent conductive film (thickness: 25 μm) was obtained. The in-plane retardation Re(550) of the obtained base material...

Embodiment 2

[0150] Except having made thickness into 15 micrometers, it carried out similarly to Example 1, and obtained the base material for transparent conductive films. The in-plane retardation Re(550) of the obtained base material for transparent conductive films was 2.1 nm, and the dimensional change ratio (MD / TD) was 0.04 / 0.04. Furthermore, the transparent conductive film was obtained similarly to Example 1 using the obtained base material for transparent conductive films. The obtained transparent conductive film was subjected to the evaluations of (3) and (4) above. The results are shown in Table 1.

Embodiment 3

[0152] Except having made thickness into 40 micrometers, it carried out similarly to Example 1, and obtained the base material for transparent conductive films. The in-plane retardation Re(550) of the obtained base material for transparent conductive films was 2.8 nm, and the dimensional change rate (MD / TD) was 0.08 / 0.09. Furthermore, the transparent conductive film was obtained similarly to Example 1 using the obtained base material for transparent conductive films. The obtained transparent conductive film was subjected to the evaluations of (3) and (4) above. The results are shown in Table 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
glass transition temperatureaaaaaaaaaa
densityaaaaaaaaaa
Login to view more

Abstract

The present invention relates to a substrate for a transparent conductive film and a transparent conductive film. Provided is a substrate for a transparent conductive film that can realize a transparent conductive film with a small in-plane phase difference while suppressing curling, whitening, and cracking. A film containing a predetermined polyester resin and having a small dimensional shrinkagein the first direction and the second direction orthogonal to the first direction is used.

Description

technical field [0001] The present invention relates to a substrate for a transparent conductive film and a transparent conductive film. Background technique [0002] Conventionally, various resin films have been used as base materials for transparent conductive films used in touch panels and the like. Examples of materials constituting such a resin film include polyethylene terephthalate (PET) and cycloolefin-based resins (COP). However, curling, whitening, and / or cracking may occur in conventional transparent conductive films. [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Laid-Open No. 2017-190406 Contents of the invention [0006] The problem to be solved by the invention [0007] The present invention was made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a substrate for a transparent conductive film that can realize a transparent conductive film that ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L69/00H01B5/14
CPCC08J5/18H01B5/14C08J2369/00C08J7/044C08G64/16
Inventor 中原步梦清水享
Owner NITTO DENKO CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap