Substrate for surface protective film, method for manufacturing substrate, and surface protective film using substrate
A technology for protecting films and substrates, applied in the direction of film/sheet-shaped adhesives, instruments, polarizing elements, etc., can solve problems such as rainbow unevenness, efficiency reduction, and optical inspection accuracy reduction, and achieve excellent flexibility or Effects of bending resistance and phase difference in small planes
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Embodiment 1
[0101] 1-1. Preparation of polymer alloy
[0102] As raw materials, the following were used.
[0103] FDPM: 9,9-bis(2-methoxycarbonylethyl)fluorene [dimethyl ester of 9,9-bis(2-carboxyethyl)fluorene (or fluorene-9,9-dipropionic acid)] , was synthesized in the same manner except that tert-butyl acrylate described in Example 1 of JP-A-2005-89422 was changed to methyl acrylate [37.9 g (0.44 mol)].
[0104] BPEF: 9,9-bis[4-(2-hydroxyethoxy)phenyl]fluorene, manufactured by Osaka Gas Chemicals Co., Ltd.
[0105] EG: ethylene glycol
[0106] PC: Bisphenol A type polycarbonate resin, "Iupilon H-4000" manufactured by Mitsubishi Engineering-Plastics Corporation
[0107] 1.00 moles of FDPM, 0.80 moles of BPEF, and 2.20 moles of EG were added as a transesterification catalyst of manganese acetate tetrahydrate 2×10 -4 Mole and calcium acetate monohydrate 8×10 -4 Mole, slowly heated and melted while stirring. After heating up to 230°C, add trimethyl phosphate 14×10 -4 mole, germanium...
Embodiment 2
[0114] Except having set the stretching speed to 3.1% / sec in both the longitudinal direction and the width direction, it carried out similarly to Example 1, and obtained the base material for surface protection films. Re(550) of the obtained substrate for a surface protection film was 10 nm, Rth(550) was 81 nm, haze was 0.2%, and the MIT test value exceeded 2000 times which is the upper limit. The obtained substrate for a surface protection film was subjected to the evaluations of (4) and (5) above. The results are shown in Table 1.
Embodiment 3
[0116] Except having set the stretching speed to 6.5% / sec in both the longitudinal direction and the width direction, it carried out similarly to Example 1, and obtained the base material for surface protection films. Re(550) of the obtained substrate for a surface protection film was 20 nm, Rth(550) was 85 nm, haze was 0.3%, and the MIT test value exceeded 2000 times which is the upper limit. The obtained substrate for a surface protection film was subjected to the evaluations of (4) and (5) above. The results are shown in Table 1.
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