Plating electrode protection devices, plating systems, and semiconductor processing equipment

Abstract

The invention provides an electroplating electrode protection device, an electroplating system and semiconductor processing equipment. The protective device includes a protective cover and a driving mechanism connected to the protective cover; when the electroplating electrode is in a non-plating state, the driving mechanism drives the protective cover to move above the electroplating electrode, and when the electroplating electrode is in an electroplating state, the driving mechanism drives the protection The hood is removed from above the plating electrodes. In the electroplating electrode protection device of the present invention, when the electroplating electrode is in the non-electroplating state, the driving mechanism drives the protective cover to move above the electroplating electrode to protect the electroplating solution and other impurities from falling onto the electroplating electrode, thereby effectively avoiding the formation of non-conductive electrodes on the electroplating electrode. Particle impurities (such as solid salt, etc.), which can improve the process production yield of the parts to be electroplated (such as wafers, etc.), and reduce production costs. When the electroplating electrode is in the electroplating state, the driving mechanism drives the protective cover away from above the electroplating electrode, so that the electroplating electrode can normally complete the electroplating process.

Description

technical field [0001] The invention belongs to the technical field of semiconductor equipment, and in particular relates to an electroplating electrode protection device, an electroplating system and a semiconductor processing equipment. Background technique [0002] The packaging method of the connection between the LCD panel driver chip and the circuit board mainly uses gold bump plating technology, which can greatly reduce the size of the driver chip, and also make it directly embedded on the circuit board, which has the characteristics of saving space, low induction and good heat dissipation. . The gold bump growth process mainly includes sputtering, exposure and development, electroplating, and etching processes, among which electroplating is particularly important as a gold bump growth step. [0003] Traditionally, in the electroplating process, each wafer device is electroplated on one side of each fixture. During electroplating, the fixture needs to be placed in th...

AI Technical Summary

Problems solved by technology

When electroplating is performed next time, due to the existence of non-conductive solid salt on the electroplating electrode, the electrode points on the fixture cannot fully and effectively contact the electroplating electrode, the resistance is too large, and the current and voltage are abnormal, resulting in abnormal height of the electroplated bump. Affect the yield rate of the product, serious need to rework

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