Electroplating electrode protection device and electroplating system and semiconductor processing equipment

Abstract

The invention provides an electroplating electrode protection device, an electroplating system and semiconductor processing equipment. The electroplating electrode protection device comprises a protection cover and a driving mechanism. The driving mechanism is connected to the protection cover. When an electroplating electrode is in a non-electroplating state, the driving mechanism drives the protection cover to move to an upper part of the electroplating electrode, and when the electroplating electrode is in an electroplating state, the driving mechanism drives the protection cover away fromthe upper part of the electroplating electrode. When the electroplating electrode of the electroplating electrode protection device is in the non-electroplating state, the driving mechanism drives theprotection cover to move to the upper part of the electroplating electrode to protect electroplating solution and other impurities from falling onto the electroplating electrode, so as to effectivelyavoid the formation of non-conductive particulate impurities (such as solid salt and the like) on the electroplating electrode, thereby increasing process production yields and reducing production costs of electroplated parts (such as wafers and the like). When the electroplating electrode is in the electroplating state, the driving mechanism drives the protection cover away from the upper part of the electroplating electrode, so that the electroplating electrode can complete the electroplating process normally.

Description

technical field [0001] The invention belongs to the technical field of semiconductor equipment, and in particular relates to an electroplating electrode protection device, an electroplating system and a semiconductor processing equipment. Background technique [0002] The packaging method of the connection between the LCD panel driver chip and the circuit board mainly uses gold bump plating technology, which can greatly reduce the size of the driver chip, and also make it directly embedded on the circuit board, which has the characteristics of saving space, low induction and good heat dissipation. . The gold bump growth process mainly includes sputtering, exposure and development, electroplating, and etching processes, among which electroplating is particularly important as a gold bump growth step. [0003] Traditionally, in the electroplating process, each wafer device is electroplated on one side of each fixture. During electroplating, the fixture needs to be placed in th...

AI Technical Summary

Problems solved by technology

When electroplating is performed next time, due to the existence of non-conductive solid salt on the electroplating electrode, the electrode points on the fixture cannot fully and effectively contact the electroplating electrode, the resistance is too large, and the current and voltage are abnormal, resulting in abnormal height of the electroplated bump. Affect the yield rate of the product, serious need to rework

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