Resin composition and cured product of same, adhesive for electronic component, semiconductor device, and electronic component
A technology of resin composition and electronic parts, applied in the field of electronic parts, can solve the problems of unsuitable adhesive, poor resistance, poor solvent resistance, etc., and achieve the effect of high reliability
Inactive Publication Date: 2020-08-11
NAMICS CORPORATION
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Therefore, there is a problem that the solvent resistance is poor
However, if the cured product is increased in glass transition temperature (increased in Tg), there is a problem that the resistance to impact at the time of dropping is deteriorated.
Therefore, it is not suitable as an adhesive for electronic parts such as voice coil motors (used in VCMs, focusing of cameras, etc.), image sensor modules, etc.
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1～8、 comparative example 1～3
[0080] According to the formulations shown in Tables 1 and 2, the raw materials were mixed and then dispersed using a three-roll mill at room temperature. In this way, the resin compositions of Examples 1-8 and Comparative Examples 1-3 were produced.
[0081]
[0082] "Members used in the measurement of drop impact resistance test"
[0083] Component 1: SUS substrate
[0084] Part 2: Ni coating block, size: width: 9mm x length: 9mm x thickness: 4mm
[0085] "Determination method of drop impact test"
[0086] (i) The prepared resin composition (sample) was coated as an adhesive on a SUS substrate. The coating size was width: 9 mm x length: 9 mm x thickness: 0.3 mm.
[0087] (ii) A Ni coating block was placed on the coated sample to prepare a test piece.
[0088] (iii) Put the test piece into an oven heated to 80° C., and heat-cure the sample for 30 minutes.
[0089] (iv) After heating and curing the sample, the test piece was taken out from the oven, and the height at whi...
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Abstract
The purpose of the present invention is to provide: a resin composition and a cured product of the same which, after curing, has excellent impact resistance when dropped as well as excellent solvent resistance; an adhesive for an electronic component comprising the resin composition; a semiconductor device comprising the cured product of the resin composition; and an electronic component. The resin composition is characterized by comprising (A) a hydrogenated bisphenol A epoxy resin, (B) a multifunctional thiol resin, and (C) a curing catalyst, and by the elastic modulus of the cured product at 50 DEG C being at least 0.5 GPa. The (B) component is preferably a resin composition comprising a glycoluril compound.
Description
technical field [0001] The present invention relates to a resin composition and its cured product, an adhesive for electronic parts, a semiconductor device, and an electronic part. In particular, it relates to a resin composition suitable for an adhesive for electronic parts, a semiconductor device including a cured product of the resin composition, and an electronic part. Background technique [0002] Currently, electronic components are incorporated in portable terminals and the like used. There are many applications requiring drop impact resistance (hereinafter referred to as resistance to impact when dropped) for such portable terminals. Therefore, such resistance is required for resin compositions used for bonding electronic components and the like. [0003] On the other hand, for the resin composition used in the bonding of electronic parts, etc., it is also required to withstand the cleaning process for removing soldering flux and dust in the manufacturing process, ...
Claims
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IPC IPC(8): C08G59/66C09J11/04C09J11/06C09J163/02H01L21/52
CPCC08G59/66C08G59/24C08G59/245C08G59/306C09J163/00C08K3/36C08L63/00C08G59/68C08L81/00C09J11/04C09J11/06H01L21/52C08G59/4021C08K5/37C09J163/04C09J163/10
Inventor 阿部信幸岩谷一希
Owner NAMICS CORPORATION